"The Kobiyahshi Muru", or the no-win scenario... (4 Messages)
0805 SMD capacitor bridging problem (2 Messages)
1206 Capacitors on 1812 Pads (3 Messages)
28 Ohm Airline Standard (2 Messages)
3D Modeling (4 Messages)
: CAD format (7 Messages)
: Quantify Flux Residue (3 Messages)
: Tooltronics Ultraclean II repair? (1 Message)
<No subject> (5 Messages)
About contamination testing (2 Messages)
About rework technology (3 Messages)
ADMIN REPLY: [TN] To be Lead-Free (2 Messages)
Ag on Ni - effect of baking (11 Messages)
Ag on Ni - effect of baking in sun , related tech conten t (3 Messages)
Air conditioning in assembly areas (2 Messages)
aluminum bonded PCB (6 Messages)
AMKOR engineering contact (1 Message)
Any IPC specifications on more than 1 wires/leads per through-hole (1 Message)
Anyone wave soldering SMA (DO-214AC) diodes? (2 Messages)
Application Sides (2 Messages)
Applied Voltage across the anode and cathode (1 Message)
Au on Ni (1 Message)
Au on Ni , back to cooking of Ag on Ni (2 Messages)
Auto-insertion lead-to-hole ratios... (8 Messages)
AW: info about creepage distance (1 Message)
AW: Mask coming off again...repair recomendations. (1 Message)
Axial lead preparation (6 Messages)
Baking of boards (26 Messages)
BeCu with bright tin finish solderability (3 Messages)
BGA application (2 Messages)
BGA Design and CTE Mismatch (2 Messages)
BGA inspection other than X-ray (2 Messages)
BGA pads size (6 Messages)
Black nickel barrier problem w/immersion Ni/Ag (2 Messages)
blind via fill (2 Messages)
Board cleaning (8 Messages)
Board thickness (1 Message)
Board Vender Date Code/Logo Search (2 Messages)
Boards Cleaning II (4 Messages)
Burn in board? (2 Messages)
CADSTAR Placement file (3 Messages)
Capacitor issues (resistors do it too!) (2 Messages)
Capacitor issues... (2 Messages)
Change in Dielectric over Temp (2 Messages)
Chip backside metal (3 Messages)
Chip backside metal (poor thermal conductivity of polyme rs) (1 Message)
Chip backside metal (poor thermal conductivity of polymers) (1 Message)
Chloride - Chlorine (6 Messages)
Cleanroom (2 Messages)
component analysis lab (1 Message)
component Hole dia v/s lead dia for better solder fillet (4 Messages)
Component packages (5 Messages)
Conclusion of confusion (1 Message)
DFM Statement (2 Messages)
Digital Camera (1 Message)
Direct Metalization (2 Messages)
Direct Metalization of LPI (3 Messages)
Disposal of FR-4 scrap and offcuts (5 Messages)
Do NOT OPEN Life STAGES (1 Message)
Documents for mil-std-105D or E ??? (2 Messages)
DOD Designs... (12 Messages)
Double sided boards using only (2 Messages)
Double sided boards using only one stencil (3 Messages)
Drill bits & router bits (1 Message)
Dual Gauge Lead Frame Supplier (1 Message)
Dual Gauge Lead Frames (1 Message)
Duplicated messages? (1 Message)
E-mail forum break in service 30 June (1 Message)
Electrical testing of bare board (4 Messages)
Electroplating reference book (2 Messages)
Environmental Alert: Etchant Recycling in California (1 Message)
EOS-models for bi/unipolar semis (3 Messages)
ESD Coats (17 Messages)
ESD Lab coats (3 Messages)
ESD requirements at higher temperatures. (2 Messages)
Etchant Recycling Situation (1 Message)
Exchange capacitors (1 Message)
Failure Rate for Reflow Process (2 Messages)
Filled via holes (7 Messages)
Fire protection and electronic parts (1 Message)
FITS (1 Message)
Flip chip (3 Messages)
Flip chip underfill delamination (2 Messages)
Fluorinert FC-43 (1 Message)
FR4 (2 Messages)
FR4 Shortages - is there a problem? (4 Messages)
GaAs Cracks (4 Messages)
Generic question about Flux types... (9 Messages)
Gold over Copper?!? (11 Messages)
Gold over Copper?!? (II) (2 Messages)
half-a-hole (4 Messages)
High Temperature PWB (5 Messages)
ic-packages (2 Messages)
Immersion Silver/Tin PCB Supplier in Asia (1 Message)
Immersion Tin Suppliers (3 Messages)
Immersion White Tin (9 Messages)
Inductor measuring equipment... (3 Messages)
info about creepage distance (8 Messages)
Interpretation of JEDEC requirements (2 Messages)
Intrusive Reflow (4 Messages)
IPC designer certification - Paper Doll (4 Messages)
IPC Listserv Up (1 Message)
IPC Listserv will be down at 2:00 PM CDT (1 Message)
IPC Roadmap Draft IV Available for Review and Comment (1 Message)
IPC test labs (8 Messages)
IPC-1731 Available for Free Download (1 Message)
kgf/pcs unit? (4 Messages)
Laminate condition (12 Messages)
LCD Design Bureaus (1 Message)
Lead Forming and Component Placement Questions (6 Messages)
lead straightening procedure (3 Messages)
Life stages (2 Messages)
Life stages virus (9 Messages)
Life stages virus detection (1 Message)
Life stages virus, just a thought !! (3 Messages)
Lifted Land was <No Subject> (4 Messages)
Linewidth Question (2 Messages)
Loaded board rework (14 Messages)
Looking for Information (1 Message)
looking for prototype subcontractor (1 Message)
Loss of a Tech Netter (2 Messages)
Mask coming off again...repair recomendations. (2 Messages)
Materials for capacitors (2 Messages)
Materials Testing Laboratory (5 Messages)
Mercury Vapor vs.Metal Halide (1 Message)
MIL question (1 Message)
MIL-2000A DIP lead clinch requirement? (4 Messages)
MTC Tray Material? (3 Messages)
Multi layer ceramic fab (5 Messages)
Need Component Placement Info (6 Messages)
Need Flux neutralizer replacement (2 Messages)
New J-STD-001 B to C video (1 Message)
non-contact flying probe (4 Messages)
non-contact flying probe...more info (3 Messages)
Note from KEMET (1 Message)
OT Admin (3 Messages)
Other visual tests under a BGA possible? (17 Messages)
Out-of-Office Auto-Replies (1 Message)
oval pin into oval hole (9 Messages)
Package Reliabiity Testing. (1 Message)
PADS format compatibility (1 Message)
Palladium > Nickel (10 Messages)
Palladium Barrier (2 Messages)
Palladium query (4 Messages)
paper carrier tape thickness (1 Message)
PC401 Soldermask (3 Messages)
PCB fab chemical question (5 Messages)
PCB Inspection (13 Messages)
PCB Inspection - Alain Savards reference. (3 Messages)
PCB Inspection Cos. In Asia (1 Message)
PCB Materials/Soldermask (3 Messages)
PCB trace at high freq. (3 Messages)
PCBA Storage conditions? (1 Message)
PE: PCB Inspection (7 Messages)
plated thru hole solder fill (2 Messages)
Plating Thieving (1 Message)
Prefag 3B (2 Messages)
PROCESS/DESIGN GUIDELINES FOR STENCILS (5 Messages)
PSGA (1 Message)
Pull Test for Glue Process (3 Messages)
PWB minimum thickness and bend radius (4 Messages)
PWB: Flex Circuit Testing: (see TM-650 m2.4.3.1) (1 Message)
PWB: Flex Circuit Testing: Looking for Flexural Fatigue Tester for flex circuit materials (see TM-650 m2.4.3.1) (1 Message)
Quad feeder repairs (1 Message)
Quad feeders (1 Message)
question about pre-heat & SIR (6 Messages)
Question about Zestron (4 Messages)
Question regarding Immersion White Tin (9 Messages)
R: [TN] info about creepage distance (1 Message)
RCC Foil Time-To-Delam Testing (3 Messages)
Reference Source for Design (2 Messages)
Reflective AOI systems (2 Messages)
Reflow Oven Causing Bridging??? (4 Messages)
Reliability Prediction Methods (7 Messages)
Removal from automatic notices (1 Message)
Repeted : MIL question (3 Messages)
Request for Adhesive Information or Assistance (2 Messages)
Request for info. (3 Messages)
Resistor termination disappearing (5 Messages)
Saponifiers and safety (7 Messages)
Scale Flow Test - Question (5 Messages)
Scaling on PBGA Balls after reflow. (4 Messages)
SHOCK TESTING (2 Messages)
Short on 098-0114-002 Fabs. (1 Message)
sign off technet (1 Message)
Silver migration (6 Messages)
Silver migration articles (3 Messages)
Single sided PWB (4 Messages)
SIR test question... (1 Message)
SMT Components (1 Message)
SMT Reels Issues. (5 Messages)
SNEC meeting (1 Message)
Solder ball test (1 Message)
Solder Fill (5 Messages)
Solder Mask & ENIG (1 Message)
Solder on gold finger (1 Message)
Solder pot temp. (2 Messages)
Solder Touch-up of probe marks (3 Messages)
SolderMask SIRPI (2 Messages)
SOLVENT's OCCUPATIONAL SAFETY (3 Messages)
Stencil Guidelines (1 Message)
still confused (28 Messages)
stretch and shrinkage of bare boards (3 Messages)
Stripper Chemistries (4 Messages)
Surface Mount Equipment (3 Messages)
Surface Roughness Measurement (3 Messages)
Symantec (Norton Anti-virus) Provides Fix Tool for Fast-spreading VBS.STAGES.A Worm (1 Message)
Ta: wirebonding and EFO (2 Messages)
TechNet Digest - 28 Jun 2000 to 29 Jun 2000 - Special issue (#2000-406) (1 Message)
Termination/Soldering Combination (4 Messages)
Tg (4 Messages)
Thermal Profiling (5 Messages)
Thermal shock profile (4 Messages)
This is a reminder that all IPC e-mail forums will be down for approximately two hours between 2:00 (1 Message)
To be Lead-Free (1 Message)
To X-ray or Not to X-ray. (10 Messages)
Tombstoning and missing parts on 0805 Resistors (1 Message)
Tooltronics Ultraclean II repair? (2 Messages)
TVS vs Varistor (1 Message)
unsubscribe (2 Messages)
V-score depth (12 Messages)
V-Score--stress (12 Messages)
Variation in plating thickness on blind vias (3 Messages)
Via-hole vs. component pin ??? (2 Messages)
virus security (1 Message)
Vision inspection systems recommendation (2 Messages)
Warpage, Flatness and Surface Profile (4 Messages)
Watermark (2 Messages)
Wave solderable inserts for loose wires (3 Messages)
Wave Soldering High Rel PCAs (3 Messages)
Wave Soldering with 0402 component or smaller (2 Messages)
Wavesoldering SMD chip resistor (4 Messages)
Where O where did Vertical Conveyor Modules Go? (2 Messages)
White Emersion Tin? (2 Messages)
wirebonding EFO (3 Messages)
Wrinkles in copper foil (3 Messages)
X-outs (3 Messages)
XENIX FILE SERVERS/Excellon DNC1.3 (1 Message)
Zyphertronics's low melt solder rework alloy and rework station? (4 Messages)
[TN] Auto-insertion lead-to-hole ratios... (1 Message)
[TN] Immersion White Tin (1 Message)
[TN] Other visual tests under a BGA possible? (1 Message)