I have a customer with a specification for bare board warpage, but the part
also has flatness and surface profile requirements on the print.  The
warpage requirement is in the customer's specification, which also says that
any print requirements supercede the spec.

Are flatness and warpage the same thing?  Or are they additive?  If the
flatness spec is based on Maximum Material Condition do I get to include the
warpage as separate MMC condition that's in addition to the flatness
requirement?

I've never been able to find anything in the ANSI Y14.5 for warpage, bow or
twist which are the terms most of us are familiar with.   Can anybody help
me out here?
Mike McMaster
RF Product Engineer
Merix Corporation
Forest Grove OR
503-992-4263

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