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June 2000

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Subject:
From:
Howard Lin <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 22 Jun 2000 16:54:26 +0800
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Hi TechNetters,

We do some testing  of  bare board right now.  Can anyone point out what
different between board with solder mask and without solder mask  on
electrical testing process? If we apply 250 voltage on 3.5 mil spacing
pattern , will it damage electrical character? Is there copper migration
occuring during 250 voltage testing?

Howard Lin

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