Hi Rick,
One of the reasons for tenting PTVs or filling them with some dielectric is
to prevent partisl solder fills in these holes. tenting, as well as even
partial fills of dielectric do not produce appreciable stress risers.
Werner Engelmaier
In a message dated 6/29/00 7:51:37, [log in to unmask] writes:
>Werner,
>What about tented vias using LPISM. And...is this done by flooding using
>a dot pattern for the vias only? We typically tent using DFSM however,
>at times there are requirements for LPI.
>TIA,
>Rick Howieson

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