Hi Rick, One of the reasons for tenting PTVs or filling them with some dielectric is to prevent partisl solder fills in these holes. tenting, as well as even partial fills of dielectric do not produce appreciable stress risers. Werner Engelmaier In a message dated 6/29/00 7:51:37, [log in to unmask] writes: >Werner, >What about tented vias using LPISM. And...is this done by flooding using >a dot pattern for the vias only? We typically tent using DFSM however, >at times there are requirements for LPI. >TIA, >Rick Howieson ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################