From: Paul M Fly

James,

  Are these flipchip parts you plan to use ASICs you have some control
over? A problem we have seen
when working with bare die is when the vendor does a die shrink. The
location of I/O can shift dramatically!
With obvious effects when you try assembling parts to your boards.

*********************************
          Paul Fly

Eastman Kodak Company
Engineering Technology Center
901 Elmgrove Rd.
Rochester, New York 14653-5313
Phone: (716) 726-5670
Fax: (716) 726-0275
E-mail: [log in to unmask]
*********************************





"Terveen, James/@NARDAEAST" <James.Terveen on 19/06/2000 15:20:27

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to "Terveen, James @ NARDAEAST" <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: Paul M Fly/243609/EKC)
Subject:  [TN] Flip chip




We are in the process possibly using a number of flipchip components on a
new design.  I know that a number of you out there have used them already.
Just was wondering what pit falls I may not want to fall into or just an
overall do's and don'ts when it come to using them... Thank in advance

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