Ken,

I tried it for removal of power MOS-FETs (bare die, approx 0.300"square)
from ceramic substrates without a great deal of success.  This was most
likely due to having very little exposed (initial attachment) solder (Sn 63
or Sn 10) exposed for their low-melt solder to alloy with.  For this
application it was also not very user friendly for keeping the nearby
conductives (10 mil line and space) free of rework solder.  I also had some
initial reservation about residual low-temp solder remaining to corrupt the
subsequent joint - but I never got that far.

I am sure it would work quite well for most SMD's with relatively large
exposed solder joints, etc.

I would at least do some DSC's on resulting joints to assure myself that the
melting point had not changed too much.

What this does to the microstructure and resulting reliability, I can not
answer.  Possibly some of the real solder guru's out there have comments.

Steven Creswick
CTS RF Integrated Modules






At 12:20 PM 6/9/00 -0700, you wrote:
>Can anyone share experience/concerns of Zyphertronics's low melt solder
>rework alloy and rework station?
>
>
>re,
>ken patel
>______________________________________________________
>Ken Patel                       Phone:  (408) 490-6804
>1708 McCarthy Blvd.             Fax:    (408) 490-6859
>Milpitas, CA 95035
>
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