Eric -

There is no substitute for a good clear set of notes on what you have done,
and the results it produced.  When developing a soldering profile, one of
the most important factors is to work within the limits that the flux
manufacturer has established for his product.  Rate and duration of preheat
and speed thru the soldering function are all dependent on the ability of
the flux, its solvents and activators to perform.

Just a few of the particulars include:
    If you heat too rapidly or slowly, and expend the activators prior to
the peak of the soldering process, chances are that you will have very
significant wetting problems;
    Too slow a conveyor speed will generally result in starved or minimal
solder fillet sizes, while too rapid a speed will generally result in peaks
and bridges.

Board assemblys tend to group themselves by "thermal mass", so that eight or
ten good profiles will solder most all product, except for the very extreme
cases.

Holler if ya need help from the geezer set!!

Regards - Kelly





-----Original Message-----
From: Eric Kalgren <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Friday, June 30, 2000 12:57 PM
Subject: [TN] Wave Soldering High Rel PCAs


HI all!

As we are starting to do more and more wave soldering, the question of
profiling and recipe changes has come up.

Specifically, should one run a new profile for every single recipe change?
i.e. the first profile looked good, but a couple of IC leads aren't
soldering as well as they should, so I want to bump the preheat up a couple
of degrees.
Or does one just make the change?

Thanks,


Eric Kalgren
BFGoodrich Aerospace
Space Flight Systems
[log in to unmask]
(505) 938-5139

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################