% of lead wetting (2 Messages)
(Fwd) Termination Loss (4 Messages)
(TN) AMP Mictor (1 Message)
(TN)AMP Mictor (2 Messages)
25mil SMT connectors, 16mil TQFPs (14mm package), 0402 (1 Message)
25mil SMT connectors, 16mil TQFPs (14mm package), 0402 c hips (2 Messages)
25mil SMT connectors, 16mil TQFPs (14mm package), 0402 chips (1 Message)
3-feet drop test (4 Messages)
: Ink permanency Test and Adhesive Strength (3 Messages)
: Solder Fatigue in Space Electronics (3 Messages)
<No subject> (7 Messages)
address transfere (1 Message)
adhesive on solders (1 Message)
Adhesives for Attaching Heat SInks to IC's (4 Messages)
Adhesives on Solder (4 Messages)
Admin Reply: TN] Advertising on the TechNet Forum (1 Message)
Advertising on the TechNet Forum (10 Messages)
Alignment problem (3 Messages)
ALTERNATIVE (1 Message)
alternatives for pth (1 Message)
Aluminum core in vapor phase (1 Message)
AMP Mictor (1 Message)
Anti-Static Bags (7 Messages)
Any Users of DigitalTest MTS300 ICT Machines? (2 Messages)
AOI systems (8 Messages)
Apologies (1 Message)
ASSEM: MATTE VS GLOSSY (5 Messages)
Assembly (6 Messages)
Assembly - Russ (1 Message)
ASSEMBLY:Barcoding (3 Messages)
ASSY (1 Message)
ASSY: BGA sanity check (11 Messages)
Assy: chip on glass (1 Message)
Assy: Component Date Code Policy for No-Clean Processing (1 Message)
Assy: Reliability, exposed copper, and moisture (1 Message)
ASSY: TUNING RIBBON ATTACHMENT (1 Message)
ASSY: Use of No Clean Flux in a Nitrogen Atmosphere? (2 Messages)
ASSY: Video camera for digitized image capture (6 Messages)
Atlanta Chapter Designers Council Meeting (1 Message)
Automated Taping Machine (2 Messages)
BGA First Time Yields (3 Messages)
BGA Footprint (2 Messages)
BGA Keepout (1 Message)
BGA land patterns (2 Messages)
BGA periphery clearance (6 Messages)
BGA reconditioning service???? (3 Messages)
BGAs in SPACE applications (3 Messages)
Board Material for a 500mhz to 2ghz Application. (4 Messages)
board substrate for RF/microwave (3 Messages)
Bonding of Silica to Silica and Silica to Pd (2 Messages)
CAD question (2 Messages)
CAD Questions: Basic (4 Messages)
CAM package that support Cadence Allegro? (2 Messages)
Casting epoxy (1 Message)
CCA MOD (3 Messages)
CCA Sponsors HDI Conference (1 Message)
Chip Resistor formula for spec IPC-SM-287 (1996). (2 Messages)
Chip Termination Finish (4 Messages)
Cimnet system (1 Message)
CIRCUIT TRACE RESISTIVITY (2 Messages)
Citric acid (1 Message)
Citric cleaning (1 Message)
Cleaning Process after Electroless copper (6 Messages)
CMK Corporation (1 Message)
Compaq PCI backplanes (2 Messages)
component marking (1 Message)
Components - Exposed Cu on Component Lead Ends (5 Messages)
Conductive Belt (1 Message)
Conductive Epoxy for Solder termination (5 Messages)
Confirmation of Receipt (2 Messages)
Conformal Coating (3 Messages)
Conformal Coating? (6 Messages)
Connector problem (?) (3 Messages)
Connector problem (?) -Reply (1 Message)
Contamination Testing for Water Soluble Flux Residue (4 Messages)
Conveyorised Plasma (1 Message)
Copper diffusion into Zinc (1 Message)
Copper Invar Copper (3 Messages)
Copper Invar Copper -Reply (1 Message)
CP642 vs Micron 32mm carrier tape (2 Messages)
defect marking (5 Messages)
Deleted Message (1 Message)
Delidder (2 Messages)
DES: ODB++ format (6 Messages)
Diameter of Holes in Reinforcement (re: Flex Stiffener) (1 Message)
die shear specification (2 Messages)
Dielectric Testing (1 Message)
dip conformal coating (5 Messages)
Drill Wander (3 Messages)
Drill2Gerber converter (reply) (1 Message)
dross in the solder pot (7 Messages)
drying (1 Message)
DST Foil (1 Message)
Electroless Nickel/gold again (2 Messages)
Email address req for Electrovert (5 Messages)
Enormous MCM - M&P Q's (3 Messages)
Enquiry... (2 Messages)
Entek OSP (4 Messages)
EPCmail (1 Message)
EPS (1 Message)
Error in - GEN: DI Water System Capacity (1 Message)
exposure box (1 Message)
FAB - Laser drilled microvia resin removal? (3 Messages)
FAB etchback IPC-6012 (1 Message)
FAB: Horizontal HASL (1 Message)
Fab: info on equipment (1 Message)
Fab: plug vias (6 Messages)
FAB: Plugged, Filled &/or Tented Vias (3 Messages)
FAB: Selective Solder Stripping (4 Messages)
FAB: solder over nickel (4 Messages)
FEM modelling (2 Messages)
Fidutial Requirements (1 Message)
fine-pitch component specification (2 Messages)
Flex Circuit Board houses (8 Messages)
Flex Circuit Vendors (6 Messages)
Flex Circuit Vendors -Reply (1 Message)
Flex/rigid manufacturers in China (4 Messages)
FORD BURN IN (1 Message)
FREE Warehouse Equipment Catalog! (1 Message)
Frequency Performance of FR-4 (4 Messages)
Future new Procedures in IPC-7711 (4 Messages)
FYI Tanatalums (1 Message)
GaAs ICs (1 Message)
Gap welding to FR4 (1 Message)
Gap welding to FR4. (1 Message)
GEN: DI Water System Capacity (2 Messages)
Gen: Name (1 Message)
Gen: Name? (6 Messages)
GEN:DFM (4 Messages)
Gerber From 1:1 Artwork (4 Messages)
German-English Dictionary in CD for Telephony terms (2 Messages)
Gold Coated Solder (4 Messages)
Gold Coated Solder - a Followup (2 Messages)
Gold contamination! (3 Messages)
Gold over Tin vs. Gold over Tin-Nickel (3 Messages)
Gold plating of PWB's (2 Messages)
Gold Recovery (1 Message)
Gold thickness - Edge (1 Message)
Gold to nickel adhesion (2 Messages)
Greater Boston DC Chapter Meeting, Thursday 18-June (1 Message)
Handheld O2 Measurement (1 Message)
HEAT DISSIPATION design for power resistors (2 Messages)
Heat Reflective Coating (2 Messages)
Heat Reflective Coating -Reply (1 Message)
help!! (4 Messages)
Help/Markers (2 Messages)
HELP: Cracking Discretes on PCB's (4 Messages)
HK CONVENTIONAL CNTR SEMINAR - 28TH JULY, 1998 (2 Messages)
How to buy IPC Gerber? (1 Message)
How to Clean RMA Flux? (4 Messages)
HR Contact in Pueblo (1 Message)
hybrid manufacturing questions (1 Message)
IC top mark (6 Messages)
ICT and FT testers (2 Messages)
Immersion white Tin PCB surface finish (3 Messages)
Interim Meeting Announcement Ø FlexibleCircuits Committee (1 Message)
Interim Meeting Announcement ― Flexible Circuits Committee (1 Message)
intrusive reflow and all (11 Messages)
Ionic Contaminate Calculation (1 Message)
IPC HOLE TO LEAD RATIOS (2 Messages)
IPC Spec 4101 (Epoxy Spots) (2 Messages)
IPC standard (2 Messages)
IPC standard 4 part number description? (1 Message)
IPC Standard Question (1 Message)
IPC-T-50 (2 Messages)
IPCchat session announcement (2 Messages)
J-STD-001A vs. -001B (4 Messages)
Job opportuniyt (2 Messages)
jumper wire turnish after solder wave (1 Message)
Junk email? (2 Messages)
Land Pattern Fo (1 Message)
Land Pattern Formulas (1 Message)
Land Pattern Formulas 4 IPC-SM-782? (3 Messages)
Liquid Photoresist (1 Message)
Looking for contract mfg. (1 Message)
Love (2 Messages)
Low-melt solder alloys for desoldering (4 Messages)
MacDermid (3 Messages)
Machining of polyimide flex material. (3 Messages)
Material Database for Microelectronic Packaging (4 Messages)
materials ? (1 Message)
Measling/Crazing (4 Messages)
Mechanical properties of solder (1 Message)
Metallized teflon film (1 Message)
Micro BGA Rework (2 Messages)
MICROWAVE PCB (1 Message)
Mil-Std-2000A Question (5 Messages)
Moisture Sensitive Devices (1 Message)
Moisture sensitive SMD-ICs (6 Messages)
NASA Approved Liquid Solder Masks (3 Messages)
NASA Approved Liquid Solder Masks -Reply (1 Message)
Need E-mail address (1 Message)
Nickel foil (2 Messages)
Nickel over Copper (1 Message)
Nitrogen in the wavesolderingproces (7 Messages)
Not read: Subscribe (1 Message)
Not read: [TN] shadow plating electroless ni au (1 Message)
Obsolete FR4 0/0 (1 Message)
Obsolete TRACE 924E O/S tester - is it of any use? (1 Message)
oil well drilling pad material specs (2 Messages)
Old pcb milling machines (1 Message)
Outgassing problem in pcb's soldering (5 Messages)
Overplated blind via's (8 Messages)
Oxided Gold Tips (3 Messages)
Paradigm by Cimnet Systems (2 Messages)
Parylene Conformal Coating line requirements. (2 Messages)
PCB Defect Evaluation (1 Message)
PCB Etching Process (1 Message)
PCB finish comparison studies (4 Messages)
PCB Manufacturer: Yield & cost for Nickel-Gold v/s HASL (2 Messages)
PCB Mfg.: Yield & cost for Nickel-Gold Vs HASL (1 Message)
PCBAMP (2 Messages)
PCI Cards (2 Messages)
PEELABLE REQUIREMENT (2 Messages)
Peelable Soldermask (1 Message)
Pinholes in reflowed SMT (2 Messages)
Pink Anti-static Poly Film & PCB's (1 Message)
PLAN NOW TO ATTEND (1 Message)
Plasma cycle (1 Message)
Plastic parts (2 Messages)
Plating of SMT leads (1 Message)
Polyimide See Thru Stencils for Printing Solder Paste (2 Messages)
Polyimide Tapes for HASL, etc... (1 Message)
Poor Solderability on TSOPs (4 Messages)
Pramod Patel/solder joint reliability (2 Messages)
Punched Non-Supported Holes in FR-4 (2 Messages)
PWB Layer Stack-up (3 Messages)
PWB Procurement Recommendations (3 Messages)
Radial Cracks on Cyanide Ester resin (4 Messages)
Re2000A (1 Message)
Read: RE: [TN] shadow plating electroless ni au (1 Message)
Reference Designator Problem (1 Message)
Reference designators (3 Messages)
Reflow quiz (2 Messages)
Reflow soldering: forced gas vs. infra-red (3 Messages)
Reliability rating (2 Messages)
Reliability Risk related Electroless Nickel/immersion gold (3 Messages)
Resent: IPC Spec 4101 (Epoxy Spots) (1 Message)
Review of Mask Cure Chat (1 Message)
Rp: Selective Solering Pallets for Wave Solder (3 Messages)
Sbj: Semi Aqueous Cleaner (2 Messages)
searching for a pull test machine ! (5 Messages)
see items (1 Message)
see items stated (5 Messages)
See items stated (melfs) (1 Message)
Selective Soldering Pallets for Wave Soldering (5 Messages)
shadow plating electroless ni au (7 Messages)
Shear IPC values charts per components type (2 Messages)
silicone conformal coatings (2 Messages)
SM Components/Solder Acceptability (1 Message)
SMT Reliability (7 Messages)
SMT Tape splicers (1 Message)
SMTA Rework Symposium (3 Messages)
Sn/Bi Solder properties (1 Message)
Solder Fatigue in Space Electronics (3 Messages)
Solder Mask (1 Message)
Solder mask between fine pitch (1 Message)
Solder mask between fine pitch pads (4 Messages)
solder mask between pads part2 (1 Message)
Solder mask profile information (6 Messages)
solder preform arrays (2 Messages)
Solder problem (3 Messages)
Solder Removal Methods (5 Messages)
Solder Sample Testing? (8 Messages)
Solder smear (2 Messages)
Solderability of bare boards (1 Message)
solderability of Hasl'd boards (2 Messages)
solderability problem (4 Messages)
SOLDERBALLS on bareboards (8 Messages)
Soldering to Gold Plated Components (5 Messages)
Soldermask flaking in immersion gold process (2 Messages)
Soldermask flaking in immersion gold process -Reply (1 Message)
Soldermask flaking in immersion gold process -Reply -Reply (1 Message)
Soldermask/Pads (1 Message)
some ideas pl... (1 Message)
SOURCE FOR BACKUP (1 Message)
SPC software (3 Messages)
spray fluxing (1 Message)
Standard for P/N & BOM formats? (2 Messages)
stop TechNet email (2 Messages)
stop TECHNET! (2 Messages)
subscirbe (1 Message)
subscribe (1 Message)
Subscribe TechNet Jim Herard (1 Message)
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Sv: [TN] Electroless Nickel/gold again (1 Message)
switch from chromic-based etchants (2 Messages)
T/H Open due to air entrapment (1 Message)
tantalum caps (3 Messages)
Tape residue elimination (8 Messages)
Teardropping BGA's (4 Messages)
Tech mtg - Conductive Adhesive (1 Message)
terminals tarnished (dull) (3 Messages)
Test - please ignore (1 Message)
Textbooks on Photo tools (3 Messages)
Thanks from the woodpeck (1 Message)
Thanks, y'all (2 Messages)
Thermal Reliefs (2 Messages)
Thickness Measurements (3 Messages)
Thru-hole Reliability (6 Messages)
Torque on FR-4 (1 Message)
traces used as a fuse (1 Message)
Ultrasonic cleaning (4 Messages)
Unformed Leads (2 Messages)
Unplated thru holes (2 Messages)
Unsubscribe (1 Message)
uwave curing ovens (2 Messages)
Vendor Source (3 Messages)
VIA HOLE and COMPONENT HOLE DEFINITION (4 Messages)
Video on Wave Fluxing (1 Message)
VOC free flux/Optifluxer (3 Messages)
void size specification for BGA's (5 Messages)
Washing of small PCB (7 Messages)
Washing of small PCB vs. ESD (1 Message)
water soluble spacers (3 Messages)
Wave Solder Pot Temp-63/37 (3 Messages)
Wave v Reflow for Flexible Circuits (2 Messages)
Whew! (1 Message)
wire & tinning specs (1 Message)
Wire Bond / Test (1 Message)
Wire Bonding (4 Messages)
wire wrap (1 Message)
Wires being used on PCB Assemblies (4 Messages)
Your reply (1 Message)
[TN] component marking (1 Message)
[TN] IC top mark (1 Message)
[TN] intrusive reflow and all (1 Message)
[TN] Poor Solderability on TSOPs (1 Message)
[TN] Reliability Risk related Electroless Nickel/imme (1 Message)