We are currently performing wire bonding on a substrate for a particular
customer.  Generally this is gold wedge bonding at .7 mil find pitch.

We want to expand that operation and do small volume, high mix of custom
IC's (monolithic and some hybrid) built to an engineer's specs.  These
would be in the 1 - 200 volume for prototype or quick turnaround.  We also
want to know what other niches are open to us with our quality wire bonding
capability and how to market them and to whom (chip on board, etc..)

Any suggestions from those who have had success or who see a need that has
not been met would be greatly appreciated.

Thank you in advance for any help or thoughts!


Bryan Bloom
G&M Assembly
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