If you can do chip-on-flex, try approaching flex assmblers (Smartflex,
Tustin, CA); also Cidco (Morgan Hill, CA) used to require a great deal
of chip on flex assembly for their call ID boxes...

> -----Original Message-----
> From: Bryan Bloom [SMTP:[log in to unmask]]
> Sent: Thursday, June 18, 1998 3:23 PM
> To:   [log in to unmask]
> Subject:      [TN] Wire Bonding
>
> We are currently performing wire bonding on a substrate for a
> particular
> customer.  Generally this is gold wedge bonding at .7 mil find pitch.
>
> We want to expand that operation and do small volume, high mix of
> custom
> IC's (monolithic and some hybrid) built to an engineer's specs.  These
> would be in the 1 - 200 volume for prototype or quick turnaround.  We
> also
> want to know what other niches are open to us with our quality wire
> bonding
> capability and how to market them and to whom (chip on board, etc..)
>
> Any suggestions from those who have had success or who see a need that
> has
> not been met would be greatly appreciated.
>
> Thank you in advance for any help or thoughts!
>
> Bryan Bloom
> G&M Assembly
> [log in to unmask]
>
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