Ernst, I've seen 5 defects per million joints as a generic target for PBGA
assembly defects. I haven't seen any data or parato analysis to support this
number though.

> -----Original Message-----
> From: Chan, Marcelo [SMTP:[log in to unmask]]
> Sent: Thursday, June 11, 1998 9:34 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] BGA First Time Yields
>
> Ernst,
>
> Can you be more specific to as what you consider a defect..if bridging,
> component placement and insufficient/non-wetting are your only criteria
> then 96%
> seems low even for prototype development.....but that depends on the
> quality of
> your BGA devices as well....
> Marcelo
>
> -----Original Message-----
>         From:   Wallisch, Ernst [SMTP:[log in to unmask]]
>         Sent:   Thursday, June 11, 1998 11:26 AM
>         To:     [log in to unmask]
>         Subject:        [TN] BGA First Time Yields
>         Importance:     High
>
>         Fellow Technetters,
>
>                 I am fairly new to the world of BGAs and we have only
> built
> limited
>         quantities of CCAs with BGAs (388s and 352s on 17 layer PWBs) for
> internal
>         customers.  I am seeing a first time yield of approximately 96%.
>
>                 Is this particularly bad for a low to mid volume
> environment?
> What
>         kinds of FTY are other folks achieving?
>
>         Thanks in advance,
>
>         Ernst Wallisch
>         Manufacturing Engineering
>         Computing Devices Canada
>         [log in to unmask]
>         (613) 596-7536
>
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