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June 1998

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Subject:
From:
Todd Ness <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 30 Jun 1998 15:00:13 +0000
Content-Type:
text/plain
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text/plain (22 lines)
Hi,

I would like to know the differences between having our solder pot
temp for 63/37 solder at 261 Degrees C instead of 250 Degrees C. Will
we see less bridging and better top-side flow at the higher temp? Are
there any pros and cons for the different temperatures?

Thanks,
Todd N

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