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From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 9 Jun 1998 13:24:04 -0400 |
Content-Type: | text/plain |
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Hi folks,
Does anyone have any information regarding technical issues
behind soldering SOIC's onto flexible circuits. We have seen product
from both wave and I.R. reflow, and although the reflow method gave us
a much lower level of visual defects, we seem to have more functional
problems. Would a wave process subject the assembly to lower /
shorter temperature stress?
thanks & regards,
John Gibson
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