Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 4 Jun 1998 23:17:40 EDT |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
In a message dated 06/04/98 15:53:56, you wrote:
>Is anybody out there utilizing BGAs or Micro BGAs for any SPACE
>applications, or know if they are being used?
>
>If so, what are the applicable specifications and standards (NHB 5300, IPC)?
>
>Does anyone have qualification or testing documentation of related
>reliability?
Get yourself a copy of IPC-D-279, Design Guidelines for Reliable Surface Mount
Technology Printed Board Assemblies, and/or ANSI/IPC J-STD-013, Implementation
of Ball Grid Array and Other High Density Technology.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
|
|