I have a board that is .250" thick with 34 layers with 1 and 2 oz. copper. I
have been able to achieve a 25-50% hole fill both by hand and wave soldering.
The only component that is being soldered are sixty-four tantalum capacitors
(assembled with a partial clinch).
We normally follow IPC's 75% hole fill guideline.
Is the solder connection reliable both electrically and mechanically (we build
ATE products that do not require thermal cycles or vibration tests)?
Is 25-50% of .250 (.062"-.125") hole fill more reliable than a 75% hole fill on
a .060" board (.045 hole fill)? I've used this argument to say that it is more
reliable even though it does not meet the 75% hole fill criteria.
Thanks for any help,
Al Kreplick
Sr. Mfg. Eng.
Teradyne, Inc.
617-422-3726
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