I have a board that is .250" thick with 34 layers with 1 and 2 oz. copper. I have been able to achieve a 25-50% hole fill both by hand and wave soldering. The only component that is being soldered are sixty-four tantalum capacitors (assembled with a partial clinch). We normally follow IPC's 75% hole fill guideline. Is the solder connection reliable both electrically and mechanically (we build ATE products that do not require thermal cycles or vibration tests)? Is 25-50% of .250 (.062"-.125") hole fill more reliable than a 75% hole fill on a .060" board (.045 hole fill)? I've used this argument to say that it is more reliable even though it does not meet the 75% hole fill criteria. Thanks for any help, Al Kreplick Sr. Mfg. Eng. Teradyne, Inc. 617-422-3726 ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################