John Gibson wrote,

                Does anyone have any information regarding technical
issues
     behind soldering SOIC's onto flexible circuits.  We have seen
product
     from both wave and I.R. reflow, and although the reflow method gave
us
     a much lower level of visual defects, we seem to have more
functional
     problems.  Would a wave process subject the assembly to lower /
     shorter temperature stress?

John,

As usual, a few questions first. What kind of functional problems? Are
these polyimide flex? How many layers in the circuit? Are you prebaking
to dry them out, and then immediately processing them? What
profile/speed are you running on the IR vs. Wave? How are you fixturing
the assembly?

Andy Magee
Unemployed Flex Guru
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