¨t²Î¦^«H (2 Messages)
(Fwd) Gold Plated Edge Connectors (2 Messages)
(Fwd) Gold Plated Edge Connectors -Reply -Forwarded (1 Message)
(TN): Stressed/Fractured Joint (1 Message)
: Burr (1 Message)
: Query on IPC-A-61 (1 Message)
: Query on IPC-A-610, Rev. B (1 Message)
<No subject given> (1 Message)
<No subject given> (Stepper exposure systems) (1 Message)
<No subject> (31 Messages)
acceptance of pwb (1 Message)
Acid etching Causes and remedies for PCB industry (2 Messages)
address correction (1 Message)
ADMIN: Some useful commands and options (1 Message)
Administrative Reply to [TN] Release: DPO - IPO "How To" Tools (1 Message)
Administrative Reply: [TN] Tell me? Could Pcaster (1 Message)
Again-Most weird problem: Solder between epoxy & fab or epoxy & comp (1 Message)
Again-Most weird problem: Solder between epoxy & fab orepoxy &comp (1 Message)
Air Ion Level Measurement (2 Messages)
Alpha Metals Ionograph 500M Chemical Verification (3 Messages)
Alphametals (3 Messages)
Alphametals -Reply (1 Message)
announcement (1 Message)
ANSI-J-001 and IPC610 (1 Message)
applied to the boards (1 Message)
Article on PCB Warping (5 Messages)
Artwork Scanner (3 Messages)
ASM: Manual Assembly Houses (2 Messages)
ass'y: conformal coating contractor needed (2 Messages)
Assembly (1 Message)
Assembly Forum ??? (1 Message)
ASSY : HAND CLEANING (1 Message)
Assy: (BGAs + FPGA)/(BGAs) (2 Messages)
ASSY: Castellated (4 Messages)
ASSY: Castellated -Reply (1 Message)
ASSY: Castellated-corrected copy (1 Message)
Assy: FlipChip Microvia forum at NEPCON (1 Message)
ASSY: HAND CLEANING (3 Messages)
Assy: Other Sources for Thermocouples (6 Messages)
Assy: PBGAs (7 Messages)
ASSY: SIR test on post wave soldering / touch - up operations. (1 Message)
Assy: Solder Paste Height Measurement (9 Messages)
ASSY: Waffle Trays (1 Message)
assy:fiducials (4 Messages)
ASSY:PVA equipment (1 Message)
ASSY:Solder-On-Gold-Fingers (1 Message)
ASY/DES: Cam Software selection (2 Messages)
Atotech Black oxide (3 Messages)
Automotive PFMEA for electronics assembly (4 Messages)
Automotive PFMEA for electronics assembly -Reply (1 Message)
Auxiliary ventilation for wave soldering equipment (1 Message)
Bare board witness marks and their effect on the assembly stage (1 Message)
Barrel Cracking (1 Message)
BGA Interposer cards (2 Messages)
BGA question (3 Messages)
BGA Rework (5 Messages)
Black Oxide-rinses (2 Messages)
Black Oxide-rinses -Reply (2 Messages)
Bond Testing Equipment (3 Messages)
bright copper plating of PCB with no small (1-5um)nodule (2 Messages)
CAD Software (2 Messages)
CALL FOR PAPERS - 12th European Microelectronics (1 Message)
cam software (1 Message)
Carbamate Formation In Cyanate Ester Resin (1 Message)
CCA Statewide Conference (2 Messages)
CEM-1 Laminate - Edge Treatment (1 Message)
Change in Technet message format (2 Messages)
Change new add (1 Message)
Chip On Board (2 Messages)
Chip Scale International 98 - CALL FOR PAPERS - May 5-7, 1998 - Santa Clara Convention Center (5 Messages)
Circuit board repair kits (1 Message)
Cleanliness Test (3 Messages)
Coating over No-Clean (1 Message)
Component Marking Ink (2 Messages)
Component Reliability Database (5 Messages)
Concerns with Alpha Metals SLS65 no-clean flux (3 Messages)
Confirmation of Receipt (1 Message)
Conflict in Requirement (2 Messages)
Conformal Coat adhesion testing? (2 Messages)
Conformal coating cure for Dow Corning 2577 and 3-1765 (6 Messages)
Consultant or expert in conformal coating of PCBs. (3 Messages)
Controlled Impedance of a Backplane ... (1 Message)
Convection Oven (2 Messages)
coper oxide growth (2 Messages)
copper (2 Messages)
copy requests (2 Messages)
Correction to FSL fax no (2 Messages)
Corrosion after electroless tin finish (2 Messages)
corrosivity HASL v GOLD (2 Messages)
coupons (2 Messages)
CPCA 1998 (1 Message)
CTI Voltage (1 Message)
Cure acceleration with CO2, Humidity and Heat (1 Message)
Curing with CO2, humidity and heat. (1 Message)
Dark brown residue (1 Message)
Depression mark during soldermask exposing (4 Messages)
DES: Hole sizes for non-auto-insertable parts (3 Messages)
DES: Impedance software (1 Message)
Design over 1GHz (3 Messages)
Design: Use of Silver Filled Epoxy as Reference Plane (1 Message)
Dessicant Chamber (6 Messages)
Dielectric constants (10 Messages)
Dow 3-1765 cure (2 Messages)
Drilling of Holes (2 Messages)
Drum level alarms (6 Messages)
Dual Lane Processing (2 Messages)
Electrical Isolation Properties of Multilayer PCB's (5 Messages)
Electrical Test Definitions for IPC-ET-652 (1 Message)
Electrical Test Workshop (1 Message)
electrodep Cu foil vs. RA foil (6 Messages)
electroless Ni/Au soft/hard (2 Messages)
Entek Plus coating thickness (3 Messages)
Equinox International. (1 Message)
Expereinced PCB Sales Reps (1 Message)
FAB - Gold consumption rates (3 Messages)
FAB, Test Coupons (2 Messages)
FAB: Barrel Cracking MC-3D material (2 Messages)
FAB: cross section docs (1 Message)
Fab: Drill Bits (3 Messages)
FAB: Process controls for drilling (2 Messages)
FAB: Pure Gold Process (1 Message)
FAB; Subject: Very Fine Line (1 Message)
FBGA design (1 Message)
Fillet Height (1 Message)
Fine Line Search (1 Message)
fine pitch testing (1 Message)
Flipchip placement equip (1 Message)
Flipchip placement equip -Reply (1 Message)
Florida Cirtech (2 Messages)
FMEA means what? (4 Messages)
FS: electrovert 500C (1 Message)
GEB Laminate (1 Message)
Gen: Axarel supplier (4 Messages)
GEN: Greater Boston DC chapter meeting 2/18 (1 Message)
GEN: on the passing of a friend (1 Message)
GEN: Short course in UK on Electronic Manufacturing (1 Message)
Gerber Software (2 Messages)
GLASS ARTWORK (2 Messages)
Glue dispenser machine v/s stencil printing (6 Messages)
Glue on solder mask (1 Message)
Gold for edge-board connectors thickness (10 Messages)
gold over entire board (12 Messages)
Gold plating b/4 or after hal (1 Message)
Gold plating switch contacts (4 Messages)
Gold surface finish (3 Messages)
HASL solder specs (1 Message)
Help on drying boards (3 Messages)
Hi James, (1 Message)
High-Frequency Dielectric Constant (4 Messages)
How to treat a PWB ??? (2 Messages)
I need .059 1/1 or 1/0 GE CEM3 or AL910 laminate (2 Messages)
I'm looking to find a tranning course for PCB design & layout (3 Messages)
IC Adapters (2 Messages)
Immersion Tin (3 Messages)
Impedance Software (1 Message)
Information on learning curves. (1 Message)
Information on Silver Terminals (4 Messages)
IPC Designers Council Meeting (Atlanta Chapter) (1 Message)
IPC-610 (2 Messages)
IPC-CF-150E (1 Message)
IPCchat session announcement (4 Messages)
J-STD-001B Cleaning Call out (1 Message)
jdec trays (3 Messages)
Kapton Etching (4 Messages)
Kevlar reinforced laminate or prepreg (4 Messages)
Laminate Identification (1 Message)
Laminate surface abrasion (2 Messages)
Lamination Presses Input (2 Messages)
Laser via in pad (2 Messages)
Leaching of Gold into a solder pot? (5 Messages)
Leaching of Gold into a solder pot? -Reply (1 Message)
LEAD SPOT TEST (2 Messages)
Looking for Equipment (2 Messages)
looking for soldermask manufacturer (2 Messages)
Manufacturers Rep's Wanted (3 Messages)
Mating Tin / Gold; SIMMs and sockets (4 Messages)
metal sludge reduction (7 Messages)
MICROSCOPE REPAIRS (2 Messages)
MICROSCOPE REPAIRS -Reply (1 Message)
Microsection of Microvias (1 Message)
Microsections (3 Messages)
MicroVia info, San Diego IPC Chapter (1 Message)
Min. Annular Ring (4 Messages)
Modeling a IR reflow oven (3 Messages)
Moisture Cure for Conformal Coatings (3 Messages)
Moisture Cure for Conformal Coatings -Svar (1 Message)
Moisture Sensitive Parts (3 Messages)
Moisture Sensitivity (1 Message)
Most weird problem: Solder between epoxy & fab or epoxy & (1 Message)
Most weird problem: Solder between epoxy & fab or epoxy & comp (5 Messages)
MTBF (1 Message)
National PWB Resource Center (1 Message)
Need inexpensive method of glueing parts on PCB (2 Messages)
Nickel,Gold&solder masks (4 Messages)
NON-THERMALLY RELIEVED VIAS- ring voids (4 Messages)
NON-THERMALLY RELIEVED VIAS- ring voids -Reply (4 Messages)
NON-THERMALLY RELIEVED VIAS- ring voids -Reply -Reply (1 Message)
Omikron Immersion White Tin (2 Messages)
ORGANIC COATING(PRE-FLUX) THICKNESS MEASUREMEN (3 Messages)
OSP coating and soldermask (1 Message)
OSP Stain (3 Messages)
Paco Via Material (1 Message)
pad lifting / pad rotation (2 Messages)
pad lifting / pad rotation -Reply (2 Messages)
panel yield on back plane (2 Messages)
Panelization (4 Messages)
PBGA rework with paste? (1 Message)
PCB ASSEMBLER (1 Message)
PCB cut-out (5 Messages)
PCB desoldering (3 Messages)
PCB Laminate FAQ - need support! (3 Messages)
PCB Milling machines (2 Messages)
PCB Prototype Facility setup (3 Messages)
PCB Prototype Machine (2 Messages)
PCB Supplier (2 Messages)
PCB warpage (33 Messages)
PCB warpage - Reply (3 Messages)
PCB warpage -Reply (7 Messages)
Placement system (1 Message)
Plating Rectifier setup (2 Messages)
Polyimide (1 Message)
Polyimide and BT material (2 Messages)
polyimide damage after peroxide etching (1 Message)
Pre-stamped soldermask (1 Message)
pre-wave masking (3 Messages)
Precision Valve and Automation (1 Message)
Precision Valve and Automation -Reply (1 Message)
Press wanted (1 Message)
Probing on fine picht SMD leads (2 Messages)
Probing on fine pitch SMD leads (2 Messages)
Problem with new XZ17B Coates solder resist catalyst (1 Message)
Problems due to prepregs selection & it's fix (2 Messages)
Production Management in PCB shops (1 Message)
Pull Strengths (1 Message)
Purchase of used Microscopes (3 Messages)
PWB Cost (1 Message)
PWB COSTING (1 Message)
PWB punching tool life (2 Messages)
Quality Labels ? (2 Messages)
Question : "Crackling" noise in boards post SMT (4 Messages)
Questions Regarding Castellations on a MCM (1 Message)
Re : [TN] Circuit board repair kits (3 Messages)
Re Air Ion Level Measurement (1 Message)
Re J/STD/A-610 (1 Message)
Release: DPO - IPO "How To" Tools (2 Messages)
Reliability vs Inner Layer break Out (1 Message)
Reply Error (1 Message)
RF Plasma tool (1 Message)
RF Plasma tool -Reply (1 Message)
RMA vs. No Clean for BGA (1 Message)
Roku-Roku Sangyo, Ltd. (1 Message)
Roughness plating (2 Messages)
RP machine (1 Message)
San Diego Chapter of the IPC Designer Council (1 Message)
San Diego Chapter of the IPC Designers Council (2 Messages)
SEARCH warpage (1 Message)
single-sided solder requirements (1 Message)
SIR Testing for BGAs and CSPs (3 Messages)
SM Lead dimension specification (3 Messages)
Small holes, Thick Boards & Hole Reliability (1 Message)
SMEMA Specifications (2 Messages)
SNEC meeting (1 Message)
solder balling (2 Messages)
Solder balls spec (4 Messages)
Solder Joint wetting (3 Messages)
Solder Paste Inspection R & R Study (1 Message)
Solder Paste Printing Process (2 Messages)
Solder paste relaxation/characteristic time (1 Message)
Solder paste relaxation/characteristic time -Reply (2 Messages)
Solder Requirements for Chip Scale BGA's (4 Messages)
solder shear strength (3 Messages)
Solder-on-Gold Fingers (1 Message)
Solderability od alloy 42 (2 Messages)
Solderability of alloy 42 (1 Message)
Solderball connection (1 Message)
soldermask (1 Message)
Soldermask developing (6 Messages)
Soldermask foil (1 Message)
SolderMask Types (4 Messages)
SOURCE FOR SCREEN MESH CLOTH & EMULSION (4 Messages)
Spare part for spray fluxer (1 Message)
Specifications (3 Messages)
Specifications for cable assemblers (1 Message)
Specs on Board Warpage (1 Message)
strange word (5 Messages)
Subscribe (4 Messages)
SUPPLIER EVALUATION AND QUALIFICATION (1 Message)
Surface Finishes (6 Messages)
survey report (2 Messages)
suspended particle specifications (1 Message)
TechNet Digest - 2 Dec 1997 to 3 Dec 1997 (1 Message)
TechNet Forum....Is it just me? (8 Messages)
Technet Subscription (1 Message)
Tell me? Could Pcaster Make YOU $70,000 per Month on the NET? (1 Message)
Temporary Soldermask (2 Messages)
Temproary resist for immersion gold (1 Message)
Temproary resist for immersion gold -Reply (1 Message)
test (1 Message)
TN : Explain me about "Nodules" (1 Message)
TN Automatic evaluation of microsections (1 Message)
To On or Not to On (5 Messages)
To On or Not to On -Reply (3 Messages)
To On or Not to On -Reply -Reply (9 Messages)
To On or Not to On : Feedback (1 Message)
To On or Not to On : Thank you all (1 Message)
Tonites meeting is CANCELLED (2 Messages)
tracking assemblies (1 Message)
Training course(s)... (1 Message)
Transformer Adhesive (1 Message)
UL APPROVAL (BUILDUP PCB) (2 Messages)
Un-subscribe (3 Messages)
unsubscribe (2 Messages)
Use of Compliant pin connectors on RF material backplane (1 Message)
Use of Heat, Humidity, CO2 to Accelerate Conformal Coating Process (1 Message)
Used Optek DPL? (1 Message)
v-score depanelling tool (5 Messages)
V-scored Panel Boards (3 Messages)
Very Fine Line (5 Messages)
Vias in SMT pads (3 Messages)
Vias in SMT pads -Reply (3 Messages)
Vias Surface Mount Lands (1 Message)
Video Micrometer (1 Message)
virus alert - NO TECHNET COMMENTS ON THIS HOAX, PLEASE (1 Message)
virus alert -Forwarded (2 Messages)
Virus Alerts (2 Messages)
Voids in PTH joints (1 Message)
wavesoldering (To On or Not to On : Feedback -Reply) (1 Message)
Wet Process Equipment in Asia (3 Messages)
What can I use to clean my boards after rework if I am (1 Message)
What can I use to clean my boards after rework if I am in NO -CLEAN Tech.?????? (2 Messages)
What can I use to clean my boards after rework if I am in NO-CLEAN Tech.?????? (2 Messages)
What is the advantage of brass coated Cu foil? (1 Message)
What is the home address of TechNet (3 Messages)
Whiskers with Sn99.3 (3 Messages)
Whiskers with Sn99.3/unfused PbSn PWB plating (1 Message)
Why DI - lowest cost DI quality (1 Message)
Why DI? (3 Messages)
Why DI? -Reply (1 Message)
WIREBONDING WIRE AGE (1 Message)
Work factor (3 Messages)
X-Sectioning Boards with Micro Vias (3 Messages)
[ASSY} Prebake (2 Messages)
[ASSY} Prebake -Reply (2 Messages)
[CN] IPCchat session announcement (1 Message)
[Fwd: North Texas Chapter ~ IPC Designers Council Meeting March 5th @ 6:30PM] (1 Message)
[TN] (Fwd) Gold Plated Edge Connectors (1 Message)
[TN] Alpha Metals Ionograph 500M Chemical Verification (1 Message)
[TN] Chip On Board (1 Message)
[TN] Component Marking Ink (1 Message)
[TN] F&K & ASM equipment feedback (1 Message)
[TN] Gerber Software (2 Messages)
[TN] Glue dispenser machine v/s stencil printing (1 Message)
[TN] Gold for edge-board connectors thickness (1 Message)
[TN] gold over entire board (2 Messages)
[TN] Microsections (1 Message)
[TN] ORGANIC COATING(PRE-FLUX) THICKNESS MEASUREMEN (4 Messages)
[TN] ORGANIC COATING(PRE-FLUX) THICKNESSMEASUREMEN (1 Message)
[TN] PCB warpage (1 Message)
[TN] Soldermask developing (8 Messages)
[TN] Stencil Aperture Shapes -Reply (1 Message)
[TN] v-score depanelling tool (1 Message)
] Design over 1GHz (2 Messages)