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February 1998

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Subject:
From:
Karl Ring <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 27 Feb 1998 09:27:46 -0500
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text/plain
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text/plain (25 lines)
hello all

i have a problem with electroless tin plated boards.The cross sections show
in tented vias under the solder mask strong corrosion of the copper barrel
beneath excessive thin. The corrosion must be done in the tin bath.

Do tented vias and electroless tin give generally problems or is it a
special process  problem?

have a nice weekend

Karl

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