Hi Stephan,
Could you elaborate on the voiding issue in microbga's ?
I understand that you have done some x-ray examinations,
could you tell us what are your pass/fail criteria as to void size ?.
Have you find any relation between different solderpaste types to voids?
What , in your experience, is the assembly parameter that has the major
contribution for generating voids in bga solder joints ?
Thanks
Mickey
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