Hi Stephan, Could you elaborate on the voiding issue in microbga's ? I understand that you have done some x-ray examinations, could you tell us what are your pass/fail criteria as to void size ?. Have you find any relation between different solderpaste types to voids? What , in your experience, is the assembly parameter that has the major contribution for generating voids in bga solder joints ? Thanks Mickey ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ michael weiner Tadiran Telecommunications Ltd tel: 972-3-9262937 fax: 972-3-9261803 e-mail: [log in to unmask] homepage http://www.tadirantele.com/ ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################