We changed our process to Immersion gold and the solderability was better
     than HASL and we avoided solder spots in gold fingers.


     Mauricio Castro


______________________________ Reply Separator _________________________________
Subject: Re: [TN] gold over entire board
Author:  Gary Griffin <[log in to unmask]> at INTERNET
Date:    2/19/98 11:07 AM


It has been my understanding that this is a normal practice and should not be a
problem.  That is to say I have never had any quality issues with PCBs made this
way.


Gary



At 10:51 AM 2/19/98 -0800, you wrote:

>One of my pcb vendors (oversea) wants to fabricate boards

>using  electrolytically deposited gold (1um of Au over 5um of Ni)

>over entire board surface.  That includes hole walls, soldering

>pads, conductive traces and ground planes.  SMOBC is out the

>window and silkscreen/LPISM are last steps in board fabration

>process.

>

>This is first time that I was informed that a board vendor

>fabricates boards by depositing gold/nickel over entire board

>surface.   My questions are:

>

>What negative effects will it have for smt and th board assembly

>manufacturing?

>Are smt/th process parameters  req to be readjusted such as

>reflow profile?

>Will it increase diffusion of gold in solderpot?

>Will it increase solder joint brittleness?

>Are there long-term reliability issues?

>Is there any other negative issue that need to be addressed?

>

>There's no qualm about price.  It is better than SMOBC boards

>with electroless Au/Ni immersion on soldering pads.

>

>regards

>Matthew Park

>NII Norsat International Inc.

>

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==================================================

<color><param>0000,0000,ffff</param>Gary Griffin

Engineering Manager

Phone (408) 501-7156

Fax   (408) 437-1976

Pager 1-800-759-7243 Pin: 145-1886

Alpha pager email griffin_p or [log in to unmask]

SABER group Interface Products</color>

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