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February 1998

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Subject:
From:
David D Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 4 Feb 1998 11:23:37 -0600
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Hi Phil - take a look at Klein Wassink's book, ISBN 0-901150-14-2, chapter
6.7, pages 197-202. The technical detail is very good and there are
additional references cited. The general consensus I have observed is that
tin coatings will not whisker provided they are "poisoned" with just about
any other element (although the debates on tin whiskers  have been quite
enthusiastic at times!).

Dave Hillman
Rockwell Collins
[log in to unmask]




[log in to unmask] on 02/03/98 09:22:13 PM

Please respond to [log in to unmask]; Please respond to [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: David D Hillman/CedarRapids/Collins/Rockwell)
Subject:  [TN] Whiskers with Sn99.3




All
Subject: Solder Sn99.3/.7Cu and whiskers
I have been experimenting with one of the no lead solders, Sn99.3/Cu.7, and
it
appears to have many of the attributes that are desired for a particular
product; however, I have not been able to find any literature or recent
information on its resistance to tin-whisker growth.  If you have any
information or leads I would appreciate it.
Thanks,
Phil Hinton
[log in to unmask]
520-745-1013
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