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| Reply To: | TechNet E-Mail Forum. |
| Date: | Wed, 4 Feb 1998 12:46:12 -0500 |
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Somewhat related....Just wondering if you have an unfused PbSn plating
on small pads, can you expect it to have whiskers overtime if stored in
dry nitrogen storage....also, what problems should I expect with such
platings if I am assembling solder bumped flilp chip devices??
Marcelo
-----Original Message-----
From: David D Hillman [SMTP:[log in to unmask]]
Sent: Wednesday, February 04, 1998 12:24 PM
To: [log in to unmask]
Subject: Re: [TN] Whiskers with Sn99.3
Hi Phil - take a look at Klein Wassink's book, ISBN
0-901150-14-2, chapter
6.7, pages 197-202. The technical detail is very good and there
are
additional references cited. The general consensus I have
observed is that
tin coatings will not whisker provided they are "poisoned" with
just about
any other element (although the debates on tin whiskers have
been quite
enthusiastic at times!).
Dave Hillman
Rockwell Collins
[log in to unmask]
[log in to unmask] on 02/03/98 09:22:13 PM
Please respond to [log in to unmask]; Please respond to
[log in to unmask]
To: [log in to unmask]
cc: (bcc: David D Hillman/CedarRapids/Collins/Rockwell)
Subject: [TN] Whiskers with Sn99.3
All
Subject: Solder Sn99.3/.7Cu and whiskers
I have been experimenting with one of the no lead solders,
Sn99.3/Cu.7, and
it
appears to have many of the attributes that are desired for a
particular
product; however, I have not been able to find any literature or
recent
information on its resistance to tin-whisker growth. If you
have any
information or leads I would appreciate it.
Thanks,
Phil Hinton
[log in to unmask]
520-745-1013
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