IPC has joined forces with SMTA, IMAPS and the Chip Scale Review Magazine to create a
world-class technical forum on the development and application of chip scale
packaging technologies.
Papers and half-day workshops are sought on all aspects of CSP and other high density
packaging methodologies. Information on board level and circuit design issues are of
particular interest, since substrates are becoming the most technologically critical
aspect of successful CSP adoption.
Tuesday, May 5, will be devoted to half-day workshops. Technical sessions will follow
on May 6 and 7. The Chip Scale International 98 Exhibition opens on Wednesday, May 6.
The technical program will address device level packaging and microelectronics,
circuit design and fabrication, and board/module level assembly processes. Paper
topics covering product applications, materials , processes and equipment, test
methods, reliability and performance data will be considered.
The deadline for abstract submission is February 27, 1998. The deadline for paper
and/or presentation materials is March 27, 1998. Printed materials are mandantory in
order to present at the conference. Presentations must be non-commercial in nature,
focusing on technology rather than a company's product. All presenters will receive
full conference admission at no charge. There will be an honorarium and travel
expenses covered for workshop presenters.
To submit an abstract, please provide your name, address (including e-mail), and a
200-300 word description along with a brief biography. Please send to John Riley, IPC
Director of Education,
by e-mail: [log in to unmask] or fax: 847/509-9798.
Also, please indicate if the submission is for the technical program or for a
workshop. If it is a technical paper, please indicate the desired time (30, 45, or 60
minutes).
This is a tremendous opportunity to learn and contribute your expertise to one of the
most exciting developments in the electronics industry.
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Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
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