회신: [TN] Gold Removal (2 Messages)
"Paste in hole" standards? (2 Messages)
(1) [TN] while you're on the subject of GOLD... (1 Message)
(2) [TN] while you're on the subject of GOLD... (1 Message)
(non-tech) "Wurst, then Spam" (3 Messages)
- IPC-7095 (2 Messages)
3D Desktop Paste Inspection. (1 Message)
: AOI (1 Message)
: Unstable Fuji PDG (1 Message)
<No subject> (6 Messages)
??: [TN] Gold Removal (13 Messages)
?BEST PROFILE FOR GOLD PLATED PINS (3 Messages)
A New Listserver Announcement ... (6 Messages)
activity of No clean (2 Messages)
AD: New web page (1 Message)
adhesiveless vs. 3-layer flex (i.e. with adhesive layer) (2 Messages)
Aknowledgement (1 Message)
Alloy 42 Leaded TSOPS (11 Messages)
Antw: Re: [TN] scary tin problems ???!!! (1 Message)
Antw: Re: [TN] Sticky question (1 Message)
Antw: [TN] Information about CEM and paper phenolic PCB (1 Message)
Antw: [TN] Mechanical Straining Solder Joints (1 Message)
AOI and component marking (1 Message)
APEX - Thursday, 16 March? (3 Messages)
Associated files (1 Message)
ASSY & FAB: vias: To plug or not to plug (7 Messages)
Atotech Pulse Plating Process (2 Messages)
Available used plotter (1 Message)
B/P Yields (4 Messages)
Baking FR4 boards (9 Messages)
BARE BOARD TEST MACHINES (1 Message)
Base Material - Shortage? (6 Messages)
Bellcore: Silver & Tin (3 Messages)
Bendflex (1 Message)
Bendflex replacement??? (2 Messages)
BGA TROUBLE (1 Message)
BGAClearance (3 Messages)
boards for high current loads (3 Messages)
Bonding details for Blind Vias (1 Message)
BRUSHES TO REMOVE SOLDER BALLS -Reply (1 Message)
Ceramic Capacitor Strength Versus Size (3 Messages)
Change Associated Files in NT4 SP6a (6 Messages)
Chip packaging question (5 Messages)
Clearance around BGA (9 Messages)
Coating assemblies with no-clean fluxes (2 Messages)
Coating of assemblies with no clean fluxes (11 Messages)
Color of ceramic BGA's (3 Messages)
Commercial Interest was "More than... No Accelerator Electroless Cu ... (1 Message)
Commercial Interest was "More than... No Accelerator Electroless Cu System" (2 Messages)
Component salvage/recycling off PWAs (1 Message)
Conformal Coating Cure Process (2 Messages)
Controlled Impedance Testing (4 Messages)
Conveyor plasma (5 Messages)
Coplanarity (5 Messages)
Copper wettability (1 Message)
DEKs ProFlow for solder paste printing (2 Messages)
Dielectric Constant of FR4 (2 Messages)
Digitaltest MTS300 ICT/ATE (1 Message)
Disconnect form tech net (1 Message)
DK measurement at 2GHz (2 Messages)
Double sided mixed technology P.W.B.s.... (2 Messages)
Double sided reflow (3 Messages)
double sided reflow problems (2 Messages)
Downhole temperatures (1 Message)
Drill bit control (5 Messages)
Drill wander (2 Messages)
Dryfilm solder mask and Kyzen Compatibility (3 Messages)
Electrical Conductor Spacing for 500 V (2 Messages)
Electroless Gold Plating (1 Message)
Electrolytic Capacitor Staking Requirements (13 Messages)
Electromigration demonstration... (13 Messages)
Enthone Envision DMS-E Direct Metalization (1 Message)
ESD and Polyimide stencils... (4 Messages)
ESD for Schematics (5 Messages)
ESD issue with microblast conformal coating removal (4 Messages)
esd protection requirements (1 Message)
ESD Standards (6 Messages)
Estimating Reliability (2 Messages)
Etched "Notches" or "Nicks" in copper traces (7 Messages)
Etched "Notches" or "Nicks" in copper traces -Reply (3 Messages)
European Specification for Halogen free Material ? (1 Message)
Fiber Optic Microscope (6 Messages)
Fiber Optic Microscope -Reply (1 Message)
Fisheye Lens (3 Messages)
Flex (1 Message)
Flex Solder Wicking (1 Message)
Flex soldermask & PIC (2 Messages)
Flex-rigid with Teflon (2 Messages)
Flying Probe Testers... (3 Messages)
Gold electroplate (1 Message)
gold immersion plating (2 Messages)
gold immersion plating--An attempted explanation (4 Messages)
Gold Removal (13 Messages)
Gold Removal Clarification (1 Message)
Gold Removal for Ron (1 Message)
Hello Everybody! (4 Messages)
Help on Fab note related to gold finger (5 Messages)
HELP!! Press-fit connector! (4 Messages)
High Pressure Air Dry for PWBs - creates ESD? (10 Messages)
High Temp solders (6 Messages)
How do you assess BGA to PCB solder quality? (4 Messages)
How to detect contamination on COPPER surface (2 Messages)
How to detect contamination on metal surface (18 Messages)
HOW TO DETECT CONTAMINATION ON METAL SURFACE THAT RESULTS TOPOORADHESION (1 Message)
How to get rid off old solder sample (2 Messages)
How to know if a joint is the cause of a failure (2 Messages)
IC Socket Contact Quality (5 Messages)
Impedance Testing (4 Messages)
Inert anode options/technology (5 Messages)
Information about CEM and paper phenolic PCB (2 Messages)
Intel Test Methodology (1 Message)
Invitation to Photoresist Developing Discussion Group at Expo (1 Message)
Ionic Contamnation (5 Messages)
IPC D 275 replacement (2 Messages)
IPC HDI Performance Subcommittee (D-43) Meeting Invtiation (1 Message)
IPC Standards Development Meeting - New Projects at APEX (1 Message)
IPC subcommittee --- help! (3 Messages)
IPC- 6012 CONDUCTOR WIDTH/ANNULAR RING (2 Messages)
IPC-610 Class II and III (5 Messages)
ito (1 Message)
ITO conductive coating for glass (6 Messages)
laminate stress relief (4 Messages)
Land Pattern for LED PL-CC-2 (2 Messages)
Lead Finishes for Alloy 42 TSOPS (2 Messages)
listserv strangeness (1 Message)
Looking Foam inspection criteria (2 Messages)
Looking for DFM info on CD (3 Messages)
Looking for some help............again. (1 Message)
Low Current Density Smut (6 Messages)
Mask-tented vias (4 Messages)
MCM Lead Tinning Equipment and/or Contractors (3 Messages)
Measuring plated thru hole copper (7 Messages)
Mechanical Straining Solder Joints (7 Messages)
Micro BGAs (3 Messages)
MICROBGA's (1 Message)
MICROBGAs (2 Messages)
Microvia Technology Expoloratory Meeting (1 Message)
MIL-A-81236...Poly-Freeze?? (3 Messages)
MMIC attach (3 Messages)
moisture sensitive components (2 Messages)
Moisture Sensitive Devices - Handling requirements (1 Message)
More than you wanted to know about No Accelerator Electroless Cu System (1 Message)
MQUAD package - QFP joint defects (1 Message)
MRP Systems... (10 Messages)
MTBF (3 Messages)
MTBF calculus (1 Message)
Nail-Head Pin Soldering (3 Messages)
Needed: NJ/PA Area Acoustic Microscopy Laboratory Services (4 Messages)
NEMI/IPC Non-Halogenated Meeting at APEX (1 Message)
New Gold Standard IPC Plating Subcommittee (4-14) (1 Message)
Ni-P (1 Message)
Ni-Pd (3 Messages)
No clean flux. (1 Message)
No technical content...just humble thanks. (2 Messages)
No-Clean Question (1 Message)
Non Wet (2 Messages)
Odd Failures (2 Messages)
Of lists and OT postings (1 Message)
OK,....what in the world????? (3 Messages)
Old PWB BV delamination. (4 Messages)
On electromigration and cleanliness (1 Message)
One side vs Both side (5 Messages)
Organic Contamination (3 Messages)
Organic Contamination -Reply (1 Message)
Oven Profile Recommendations? (5 Messages)
Overhead Projection Inspection Equipment. (4 Messages)
oxide alternatives (2 Messages)
Packaging of gold plated SM devices/Standards for base soldered devices. (1 Message)
Part Numbering System (2 Messages)
PCB Layout Service... (2 Messages)
penetration grid application (1 Message)
Phase change materials (3 Messages)
Pick and Place of Melf Parts. (4 Messages)
Plating processes (2 Messages)
Plating small diameter vias in multilayer flex (4 Messages)
Plating Subcommitte meeting at IPC-Expo (1 Message)
Please remove me from Technet (1 Message)
Polyimide Stencils - "lumps" solution (1 Message)
PPF (1 Message)
process control of final cleanliness in a no-clean world (16 Messages)
Proposition 65 (2 Messages)
PTH Design For Reliability (5 Messages)
PTH Design For Reliability -Reply (1 Message)
Pump Printing (1 Message)
PWB Testing (3 Messages)
QUESTION ON J-STD-001B- POSTED AGAIN (1 Message)
Question: Film to Gerber - how? (11 Messages)
Realiability info: Failure rate with confedence level (6 Messages)
RECOATING OF GOLD FINGERS (1 Message)
Referral for GIL Boards. (1 Message)
Removing HASL & B25A Coupons (2 Messages)
REQUEST FOR SOLDER BALL INFO (1 Message)
REQUEST IPC-7525 (1 Message)
Response about tinning, and questions ... (2 Messages)
Reverse modeling (1 Message)
ReWireTinning (1 Message)
Running of Jumper wire... (6 Messages)
Saint Patrick's Day Humor [No Technical Content] (1 Message)
scary tin problems ???!!! (5 Messages)
Selenium? (3 Messages)
sending mail to the list (1 Message)
Shadow direct metalization process (5 Messages)
Shipley Ronal No Accelerator Electroless Cu System (2 Messages)
Silver Embrittlement (2 Messages)
silver migration (1 Message)
Single v/s panel info on drawing & Gerber (13 Messages)
SMT DEFECT RATES (DPMO) (5 Messages)
SnCu , SnCuAg or SnAg Plating (1 Message)
Solder at lower temperature (5 Messages)
Solder Ball (4 Messages)
Solderability of TSOP... (6 Messages)
Solderability Problems (1 Message)
soldering of receptacles in pcb (2 Messages)
Soldermask clearance (3 Messages)
Soldermask for BGA (2 Messages)
Solvent Cleaning (8 Messages)
Spamming and The Good Ole Boys (1 Message)
Spamwurst observation and some questions from the "good old (1 Message)
Spamwurst observation and some questions from the "good old boys" (1 Message)
Spec for "Lumps" on PCB (13 Messages)
Spots on Cu surfaces after OSP coating (2 Messages)
sputtering (3 Messages)
SRAM Heatsink Attach (3 Messages)
stain&gold plating (6 Messages)
Sticky question (4 Messages)
Strange email... (9 Messages)
Subj: Test Equipment Fab/Suppliers (2 Messages)
Subj: [TN] Gold Removal (4 Messages)
Subj: [TN] ISO9000: 2000 (4 Messages)
Surface prep before soldermask (6 Messages)
Tantalum capacitors (3 Messages)
TDR a system of multiple Xmission media (1 Message)
test (1 Message)
Test - please ignore (1 Message)
test facilities (1 Message)
Thanks (1 Message)
Thermal stressing (3 Messages)
Thermally Enhanced Packages! (2 Messages)
THICKNESS MEASUREMENT OF LIQUID RESIST (3 Messages)
Throwing Power of Blind Vias (1 Message)
To plug or not to plug (3 Messages)
Tools/ methods to remove solder balls (2 Messages)
Tools/ methods to remove solder balls -Reply (1 Message)
ultra-precision laser vs. visual (1 Message)
unsubscribe (2 Messages)
Urgent Help: Parts scarcity at the worse; Laser/plastic cutting (5 Messages)
Use of reclaimed devices (2 Messages)
Use of wood in PCB Assembly ?? ESD ?? (2 Messages)
Using HASL finish with BGA's (2 Messages)
UV cured white marking ink (4 Messages)
v-scoring with perimeter copper on topside (5 Messages)
vapor phase reflow (12 Messages)
Vapor Phase reflow chemicals and equipment.. (9 Messages)
Vapor Phase update... (4 Messages)
Via Hole Placement. (3 Messages)
via plugging (6 Messages)
VOC legislation (26 Messages)
VOC legislation - evolved to dark (8 Messages)
Voids in BGA Balls after reflow (9 Messages)
Warped Boards... (4 Messages)
Was; Electromigration Now; Electrochemical Migration (2 Messages)
Wave Solder Fixture Justification (5 Messages)
while you're on the subject of GOLD... (4 Messages)
White Tin (4 Messages)
White Tin instead of Gold for edge connectors (4 Messages)
Whoa Nellie! MRP Systems... (5 Messages)
Wire staking (1 Message)
Wire Tinning Specification (3 Messages)
Wire wraps (2 Messages)
Worst than Spam (12 Messages)
WS-488 (2 Messages)
[DC] Change Associated Files in NT4 SP6a (1 Message)