Dear Technet,

I am puzzled about the recommended process for sequential bonding of via
layers to give blind vias with resin caps that can be used when plated over
for electrical test points?

Do you Oxide treat the plated inner layer and then bond the board allowing
the prepreg to flow up the plated via? How do u stop the resin spewing out?
What is the best type of release film?  Is there anything special to look out
for in the bonding process?
What do u do after u bonding prior to subsequent PTH plating? Is it best to
brush or desmear or both?

Help?

Russ

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