Dear Technet, I am puzzled about the recommended process for sequential bonding of via layers to give blind vias with resin caps that can be used when plated over for electrical test points? Do you Oxide treat the plated inner layer and then bond the board allowing the prepreg to flow up the plated via? How do u stop the resin spewing out? What is the best type of release film? Is there anything special to look out for in the bonding process? What do u do after u bonding prior to subsequent PTH plating? Is it best to brush or desmear or both? Help? Russ ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################