Jason,
        Stay away from vapor phase, unless you have a specific need for it.
It can work well on large/thick laminates such as backplanes, but doesn't
offer the controlled ramp and preheat dwells that convection ovens can
provide. The fluorinated liquids are extremely expensive, and will encounter
regulatory requirements in most locales for both use and recovery of used
liquid. They will not work with high temp alloys, as the maximum
temperatures are restricted to the boiling point of the liquid (215C for
3M's Fluorinert).

Mike McMonagle
PCBA Process Engineering
Telxon Corporation
(713) 307-2443
www.telxon.com

-----Original Message-----
From: Jason Gregory [mailto:[log in to unmask]]
Sent: Wednesday, March 01, 2000 7:53 AM
To: [log in to unmask]
Subject: [TN] vapor phase reflow


Hello techies!

I am looking for anyone who has performed any qualifications on the
advantages/disadvantages of vapor phase reflow. Particularly dealing with
higher temp alloys. Is it the way to go? Is convection better? Who are the
major manufacturers? Are silicon castments to keep the bottomside components
from falling off mandatory? Any replies are GREATLY appreciated.

Jason Gregory
Production Manager
Electrospec
(713)784-4900
(713)784-1194 fax

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