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March 2000

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Subject:
From:
Michael Fenner <[log in to unmask]>
Reply To:
Michael Fenner <[log in to unmask]>
Date:
Thu, 9 Mar 2000 01:01:02 -0000
Content-Type:
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text/plain (46 lines)
Thanks I already zeroed in on Berquist hiflow 100, app is to coat ceramic for isolating power
devices.
concerns now are do we screen print or transfer print or what? What sort of screen to use, will
it stay stuck in frame if constantly heated to keep berquist molten and so on. Trying to
anticipate problem areas, volume is in several 10ks a run range, so opportunity to mass produce
rejects is good.

Mike

----- Original Message -----
From: KK Chin <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, March 08, 2000 10:06 PM
Subject: Re: [TN] Phase change materials


> Mike,
>
> I don't know your application but I guess you may visit www.bergquistcompany.com
> to look at their HiFlow series. Many other companies make phase change material
> (Chomerics, 3M, etc.) but so far we only tested the Bergquist's. HiFlow melts at
> 60degC which is just right for my application. We tested both the insulated and
> non-insulated verisons. Their thermal impedance is far better than the silicone
> rubber pad, and unlike silpad, you get very consistent thermal impedance
> regardless of the clamping pressure between the power source and the heat sink.
>
> K.K. Chin
> Artesyn Technologies,
> Fremont, CA
> http://www.artesyn.com
>

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