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March 2000

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Subject:
From:
"Hiteshew, Michael" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 3 Mar 2000 13:48:00 -0500
Content-Type:
text/plain
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text/plain (38 lines)
Kelly,
        Why not look into a silicone based adhesive. Like materials
typically bond well. Some form of silicone RTV with a metallic or ceramic
filler for heat conduction comes to mind. Try contacting the tech support
folks at IERC or Chomerics - both are mfrs of heat sink materials and
bonding systems.  -Mike Hiteshew

> ----------
> From:         Kelly Kovalovsky[SMTP:[log in to unmask]]
> Subject:      [TN] SRAM Heatsink Attach
>
> We are using an SRAM that is manufactured with a silicone based material.
> The silicone acts as a mold release during component manufacture. We are
> having problems coming up with a consistent process for attaching a
> heatsink to this component and I understand it is due to the silicone.
>
> Does anyone have any process suggestions for this situation? I am thinking
> in terms of various adhesive materials. I would like to avoid changing the
> component.
>
> Kelly Kovalovsky
>
>

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