Hello Eric,
thanks for your info.
originally most of the companies were using Ni-Pd as pre-plating finish in most
of their packages.
However, we are trying to evaluate other finishing as an alternative to Ni-Pd.
Ni-Pd had cracks after forming since it has Ni-layer which is very hard. Aside
from that Pd price suddenly goes up in the market.
I think one best requirement for this is that, it has good ductility (Upon
subject to tensile force of forming), good solderability and resistant to
corrosion after subjecting to different environmental stresses. One example is
steam aging @ 4, 8, 24 hours.
I heard of Alpha metals about Electroless Ag, i think this is good but what
about silver ion migration problem? solder joint reliability?
Can you give us more info about Electroless Ag?

Appreciate your inputs

thanks





[log in to unmask] on 03/03/2000 08:57:58 AM

To:   Jonathan A Noquil/Cebu/Fairchild@Fairchild
cc:
Subject:  Re: [TN] Non Wet




Jonathan,

We never attempted (as far as I know) to put our AlphaLEVEL Immersion Silver on
component leads, but we use it very successfully as a replacement for E-less
Ni/Immersion Au (Final Finish, i.e solderable coating) on circuit boards.  What
are the requirements for lead finishes?

Best regards.

Eric Yakobson
Alpha PC Fab




Jonathan A Noquil <[log in to unmask]> on 03/02/2000 04:19:00
PM

To:   [log in to unmask]
cc:
Subject:  [TN] Non Wet



Hello Guys,

I have experienced non-wet on the following plated surface:

1. Electroless Ni-P (P=10 %)
2. Electroless Ni-P (P=12 %)
3. Electroless Ni-AU (Au=0.02, Ni=3 to 5)
4. eLEctroless  Ni-B

the above plating finish were subjected to the following temp.

mold=175 C
then steam aging @ 4 hours, 8 hours, then 24 hours. All surfaces had now
wetting.

Does anyone have experience on the above problem

Your inputs are highly appreciated

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