Hello Eric, thanks for your info. originally most of the companies were using Ni-Pd as pre-plating finish in most of their packages. However, we are trying to evaluate other finishing as an alternative to Ni-Pd. Ni-Pd had cracks after forming since it has Ni-layer which is very hard. Aside from that Pd price suddenly goes up in the market. I think one best requirement for this is that, it has good ductility (Upon subject to tensile force of forming), good solderability and resistant to corrosion after subjecting to different environmental stresses. One example is steam aging @ 4, 8, 24 hours. I heard of Alpha metals about Electroless Ag, i think this is good but what about silver ion migration problem? solder joint reliability? Can you give us more info about Electroless Ag? Appreciate your inputs thanks [log in to unmask] on 03/03/2000 08:57:58 AM To: Jonathan A Noquil/Cebu/Fairchild@Fairchild cc: Subject: Re: [TN] Non Wet Jonathan, We never attempted (as far as I know) to put our AlphaLEVEL Immersion Silver on component leads, but we use it very successfully as a replacement for E-less Ni/Immersion Au (Final Finish, i.e solderable coating) on circuit boards. What are the requirements for lead finishes? Best regards. Eric Yakobson Alpha PC Fab Jonathan A Noquil <[log in to unmask]> on 03/02/2000 04:19:00 PM To: [log in to unmask] cc: Subject: [TN] Non Wet Hello Guys, I have experienced non-wet on the following plated surface: 1. Electroless Ni-P (P=10 %) 2. Electroless Ni-P (P=12 %) 3. Electroless Ni-AU (Au=0.02, Ni=3 to 5) 4. eLEctroless Ni-B the above plating finish were subjected to the following temp. mold=175 C then steam aging @ 4 hours, 8 hours, then 24 hours. All surfaces had now wetting. Does anyone have experience on the above problem Your inputs are highly appreciated ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################