Dear Technet:

I've been tasked by my superiors to query industry to find out what other
electronic assemblers are yielding off of their surface mount line.  To
compare apples to apples, here are my specifics:

We assemble SMT for military/high rel.  The majority of the parts are
ceramic leadless chip carriers  (LCCs) and ceramic chip components
(resistors, caps, diodes).  We're starting to track solder defects more
closely when the assemblies come right off the line, and we don't like what
we see.  The major anomaly is insufficient solder fillet on the LCCs.
(There could be one joint insufficient out of 20. By the way, solder paste
deposits are perfect!)  Whether or not these are actually defects is under
discussion.

What I'd like to know is:
1)      What kind of defect rates (PPM) are others, building similar
assemblies, getting from their SMT lines.
2)      Does anyone experience insufficient solder on LCCs?

Thanks,
Jim M.
AIL Systems Inc.
631-595-5879

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