Mike, I don't know if there is a final document. I got a copy some days ago, but it is
a draft, which was presented by an IPC trainer, and ,as YEHUDA mentioned, almost
unreadable.
Gaby
"Yuen, Mike" wrote:
> I would like to get a new copy of IPC 7095. Who is the chairperson for that
> committee?
>
> Thanks,
> M. Yuen
>
> -----Original Message-----
> From: Gabriela Bogdan [mailto:[log in to unmask]]
> Sent: Monday, March 20, 2000 4:43 PM
> To: [log in to unmask]
> Subject: Re: [TN] Voids in BGA Balls after reflow
>
> Bob,
> You can search the TechNet archives for voids in BGA solder
> balls.
> Max .allowed voids is about 20% of the ball volume, if I
> remember well from
> the draft of IPC7095.
> Bad thing is when the voids are at the interface between
> ball and component
> pad or board. I have also a "High end" x-ray equipment, and
> to my great
> amusement I can make voids appear , disappear and grow
> depending on voltage
> and current. Make sure that your picture is not "overworked"
> and that what you
> see is the real thing. If it is, it seems bad to me. Just
> for comparison, you
> can perform a cross section on a ball with big voids.
> Gaby
>
> Bob Perkins wrote:
>
> > Hello Technetters
> >
> > Recently with the help of a high end piece of
> x-ray equipment we
> > have noticed voids in the spheres of the bga after reflow,
> "see
> > attachment-file". Has anyone seen this before, or has any
> idea how the
> > voids are created? Also does anyone know if this is a bad
> or good thing?
> > Does anyone have any recommendations to the profile?
> >
> > Thanks
> > Bob Perkins
> > Automation Technician/Manufacturing Engineer
> > Aimtronics
> > [log in to unmask]
> >
> > <<wboard6.jpg>>
> >
> >
> ------------------------------------------------------------------------
> > Name: wboard6.jpg
> > wboard6.jpg Type: JPEG Image (image/jpeg)
> > Encoding: base64
>
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