TECHNET Archives

March 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Michael Fenner <[log in to unmask]>
Reply To:
Michael Fenner <[log in to unmask]>
Date:
Sun, 5 Mar 2000 12:05:17 -0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (64 lines)
Good thought, but it wasn't, it was a new development involving XXXXXXXXXXXXXXXX. !!

Mike

----- Original Message -----
From: Creswick <[log in to unmask]>
To: <[log in to unmask]>
Sent: Sunday, March 05, 2000 4:06 AM
Subject: Re: [TN] Color of ceramic BGA's


> In acknowledgement to Mike Fenner's response on this subject on Feb 29th -
>
> It is possible the blue ceramic material you witnessed was a DuPont Low
> Temperature Co-Fired Ceramic (LTCC) tape material.
>
> We use it extensively, and have no problem with automatic wire bonders
> discerning reference points on the 'ceramic'.
>
> Our wireless component customers have used many boxcar loads of this
> product, but I can not confirm the type of alignment mechanism utilized
> (some are BGA-like attachment, while others utilize peripheral attachments
> similar to leadless ceramic chip carriers).  However, receiving no
> complaints is usually a good sign.
>
> Am currently working with Philips ACM equipment on flip chip placement on
> the blue LTCC substrate.  If I have a problem - surely you will hear the
> scream from there!
>
> Steven Creswick
> CTS RF Integrated Modules
> W. Lafayette, IN  47906
>
> Ph (765) 463 2565
>
> ##############################################################
> TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
> ##############################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
> the body:
> To subscribe:   SUBSCRIBE TECHNET <your full name>
> To unsubscribe:   SIGNOFF TECHNET
> ##############################################################
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
> information.
> If you need assistance - contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> ##############################################################
>

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2