(TN) need supplier-laser cutting (1 Message)
1999 Pan Pacific call for papers (1 Message)
74ACT573 (1 Message)
: Corrective Action Limits (4 Messages)
: Digital Cameras (5 Messages)
: SMT Hand placing time standards... (4 Messages)
: What software do you use ? (2 Messages)
<No subject> (2 Messages)
Acceptability of electronical assemblies (4 Messages)
Acceptable PPM Defect Rate (2 Messages)
Acq.Reform (1 Message)
Adhesive for double sided reflow soldering (1 Message)
ADMIN MESSAGE: Attention TechNet Subscribers! (1 Message)
Alodine washing off (4 Messages)
Alternative finishes (1 Message)
Alternative to Electroless-Blasberg (1 Message)
Alumina & AlN DBC substrates needed! (2 Messages)
Anyone Using Electrovert's ELECTRA Wavesolder Machine? (2 Messages)
asking of a spec' MIL-STD-105 (1 Message)
ASSY: BGA FAILURES (7 Messages)
Assy: Cocure conductive and nonconductive epoxies (1 Message)
ASSY: Conformal Coating Forum (1 Message)
ASSY: Environmental testing to verify adequacy of conformal coating. (1 Message)
ASSY: PBGA on PCMCIA card (2 Messages)
ASSY: recycle ESD foam packing material (3 Messages)
ASSY: Surface Mounting Adhesives survey (1 Message)
ASSY: [TN] Reflow Peak Temperatures (1 Message)
ASSY[TN] Micro BGA Sockets... (2 Messages)
attn: StevaZeva reflow (2 Messages)
Autoboard 3.1 board files (1 Message)
Autoclaving Flex PWBs (6 Messages)
Automatic replenishment of Resist Stripper (1 Message)
automatic replenishment of resist stripper. (4 Messages)
AW: [TN] Adhesive for double sided reflow soldering (1 Message)
AW: [TN] Country Code (1 Message)
AW: [TN] Help! Plugging vias (1 Message)
AW: [TN] Help! Plugging vias -Reply (1 Message)
BAKING BOARDS PRIOR TO ASSY (11 Messages)
Balzer Evaporater (1 Message)
BGA opens at Xray (1 Message)
BGA opens. (2 Messages)
BGA vs QFP reliability (2 Messages)
Biphenol Resins (2 Messages)
blind and buried via's (3 Messages)
Boardsubstrates for RIMM module (2 Messages)
Bubbles from conformally coated board (11 Messages)
Build-up Wiring Boards (Stereolithography?) (1 Message)
Buildup Wiring Boards (5 Messages)
Buried Vias (2 Messages)
Burn In (2 Messages)
C.O.P.S.[TN] Assy: Cocure conductive and nonconductive epoxi es (1 Message)
Call for Papers (1 Message)
Cancellation of MIL-S-13949H (2 Messages)
Carbon Printing on PCBs (1 Message)
Cleanliness Experiment/Demonstration Ideas? (6 Messages)
Cleanliness Experiment/Demonstration Ideas? -Reply (1 Message)
Coatingthings (1 Message)
Component Sourcing (2 Messages)
confirmation (1 Message)
Conformal Coat Masking (4 Messages)
conformal coating query (1 Message)
Controlled Impedance on signals (1 Message)
copper thieving (5 Messages)
copper thieving and X-outs (1 Message)
Core punch (1 Message)
Country Code (1 Message)
CSP Assembly (1 Message)
Current Capacity of via holes (1 Message)
Current Capacity of vias (5 Messages)
DES: How do we compare (1 Message)
Design For Manufacturability(DFM) Strategy and rules (2 Messages)
Dewetting of Surface Mount pads (2 Messages)
Digital cameras (3 Messages)
DP-1500 (fwd) (2 Messages)
drill files-plated/no (3 Messages)
drill files-plated/non-plated holes (3 Messages)
Drop off Component (3 Messages)
Dummy BGAs with Resistor Chips (2 Messages)
Durapol laminate suppliers (1 Message)
El Paso Designer Council Meeting Reminder (1 Message)
Electrical Design Clearance (1 Message)
Email list (1 Message)
Enroll me in Technet (1 Message)
Environmental Testing ("insect resistance") (2 Messages)
Environmental testing - insects (2 Messages)
EPC - Wiesbaden - Updates (1 Message)
EPC - Wiesbaden - Updates -Reply (1 Message)
ESD (4 Messages)
ESD labels (6 Messages)
ESD labels..thanks (1 Message)
ETHYLENE GLYCOL CLEAN-UP (2 Messages)
Excess flux Kester 924FB (2 Messages)
Fab note for Laminate material (2 Messages)
Fab Solderability Test @ Assembly house (3 Messages)
Fab/Assy: Vias under chip components (4 Messages)
FAB: IPC-2221 confusion (3 Messages)
Fab: Multiple surface finishes (2 Messages)
FAILURE ANALYSIS LABORATORIES (4 Messages)
Fastek Netlist software (1 Message)
Fine Line technology (4 Messages)
fine pitch BGA soldering pad size (1 Message)
Fingers vs Socket & Pin on pwr supply (2 Messages)
Flash point and melting point for CEM-3 and Paper Phenol laminates (2 Messages)
Flex Circuit Fixtures for SMT (1 Message)
Flex Materials (2 Messages)
Flux Measuring Techniques (2 Messages)
Flux Measuring Techniques?? (2 Messages)
Flying Probe Bare Board Testers (2 Messages)
Fractures (1 Message)
FREE FORUM ON CONFORMAL COATING (1 Message)
From HASL to Ni/Immersion Gold (1 Message)
g10 (2 Messages)
GDSII compatible CAD software (2 Messages)
GEN (4 Messages)
Gen: photoablation substrate materials (1 Message)
Gen: Reliability Testing in Road Salt Conditions (2 Messages)
GETECK laminates (3 Messages)
Gold plated connector & peelable resist? (2 Messages)
GR-78-CORE (2 Messages)
Greater Boston Designers Council Chapter Meeting (1 Message)
Haloing on PWB (2 Messages)
Harderman Fluxes (1 Message)
HASL thickness readings (2 Messages)
Help! Plugging vias (6 Messages)
High Density Circuits (2 Messages)
Hoax ? > Ericsson ? (3 Messages)
Hole tolerances (1 Message)
HP DesignJet 650C Problems (1 Message)
IC coating (2 Messages)
Incoming Inspection Equipment (3 Messages)
Increase number of drill sizes (5 Messages)
Info about AOI (2 Messages)
Info about AOI -Reply (2 Messages)
Info on J-STD-003A "Solderability Tests for Circuit Boards" (1 Message)
Ink for insulation layer (1 Message)
Inspection criteria for no clean assembly? (3 Messages)
Insulation layer for Remote control PWB (1 Message)
INTEL PLM 96 (1 Message)
Ionograph / Cleanliness Requirement for Components (8 Messages)
IPC 4101 L25 (2 Messages)
IPC Standard for PCB Acceptance (3 Messages)
IPC-L-112 Help (1 Message)
IPC-S-815 (1 Message)
IPC/SMTA ELECTRONICS EXPO (7 Messages)
ISA card board requirements (1 Message)
Job opportunities (1 Message)
Justification for change from tht to smt (5 Messages)
Keep Out Distance for press-fit connectors. (3 Messages)
Laminate material (1 Message)
Laminates, Dk, Tg and Cost (1 Message)
Lamination process control (1 Message)
Land Pattern Calculator (2 Messages)
laser ablation material (4 Messages)
laser drilling / ablation (1 Message)
Micro Soldering (1 Message)
Micro viewer for PWB manufacturing line (2 Messages)
microannex els (1 Message)
Microscopes (2 Messages)
Mil-Std-2000 (2 Messages)
Moisture Sensitive Components (2 Messages)
MS-2000 (2 Messages)
NC machines and Y2k bug (2 Messages)
Network Analyzers (1 Message)
New IPC Desk Ref. Manual on SM Solder Joint Eval. (2 Messages)
Newbie (1 Message)
News from Stickley-Vejar (2 Messages)
No-Clean Process - Cleanliness Specification (2 Messages)
Offer for new printing line for Single side PWB (1 Message)
Open circuits from Silver Sulfide Corrosion (5 Messages)
Optical Sensor (1 Message)
Outgassing (2 Messages)
oxygen index and test method, FR4 laminates (2 Messages)
Pacific Northwest IPC DC Newsletter (1 Message)
Paint Finish Protection (5 Messages)
Pass/Fail Wetting Balance Criteria (2 Messages)
PCB Material Change (4 Messages)
PCB Material Change -Reply (2 Messages)
PCB Materials (1 Message)
Peelable mask in reflow oven (3 Messages)
Phosphorous In The Nickel Barrier (1 Message)
Planarity (2 Messages)
Plasma Machine Manufacturer (3 Messages)
Plugged Via Holes: BGA (1 Message)
PM Software Program Replacement (1 Message)
PPM Defect Rate (1 Message)
Pricing Survey (1 Message)
Printing ink supplier (1 Message)
Process Audit Points [ HELP ] (4 Messages)
Pros/Cons Moving Probe Bare Board Testers (1 Message)
PTFE Etching Processes (2 Messages)
PTFE Etching Processes -Reply (2 Messages)
Pyralux History (2 Messages)
Quad4c mark 2 placement using local fids (1 Message)
Questioning UL950 (2 Messages)
RE : [TN] PCB Material Change (1 Message)
re Warpage @ Assembly (1 Message)
Reflow of Nylon 6/6 Connector? (1 Message)
Reliable crystals/oscillators packaging (1 Message)
Reminder (1 Message)
Replacing Mil-S-13949 (2 Messages)
Reply to Posting Number 23642 (1 Message)
Resist Strip (3 Messages)
Reworking delaminated rigid-flex (6 Messages)
RF Screening cans (2 Messages)
Routing conformal coatings (4 Messages)
SCOPE DRILL OR UNIDRILL (1 Message)
Scoring Issues (2 Messages)
SCSI BackPlane Design Rules . . . (1 Message)
Seho Wave Soldering Process Procedures (11 Messages)
set technet digest (1 Message)
simulation (1 Message)
SM Component Standardization (2 Messages)
SMD on bottomside (4 Messages)
SMT - SPC fishbone chart (6 Messages)
SMT - SPC fishbone chart ? (1 Message)
SMT Connectors (7 Messages)
SMT gull wing solder joint force test? (1 Message)
Soft Solder (5 Messages)
Software upgrade question (2 Messages)
Solder "webbing" to Solder Mask After Wavesolder?? (2 Messages)
Solder ball attachment to BGA (2 Messages)
Solder Balling (1 Message)
Solder Balling Spec. (2 Messages)
Solder Balls (1 Message)
Solder Bumping (2 Messages)
Solder crack (5 Messages)
Solder Fracture during Drop Test (2 Messages)
Solder Mask (LPI) Flaking (3 Messages)
solder mask (LPI) flaking -Reply (1 Message)
Solder Paste (2 Messages)
Solder-ball (1 Message)
solderability testing (5 Messages)
Solderable Diode & IGBT (1 Message)
Soldering BGA's with Nitrogen (2 Messages)
Soldering Patents (5 Messages)
Soldering to Gold (5 Messages)
Soldering to Gold Plated Pads (6 Messages)
Solderless Interconnects (1 Message)
Soldermask Artwork Marking (3 Messages)
Soldermask Artwork Marking -Reply (1 Message)
SRT Summit 1000 Profiles? (1 Message)
Stain Mark Accept or Reject? (1 Message)
Standard for smt polarised component orientatio (1 Message)
Standard for smt polarised component orientation (2 Messages)
Stencil manufacturers (3 Messages)
Storage Temp (2 Messages)
Stress in SMT Components (3 Messages)
Subject: Flying Probe Bare Board Testers (1 Message)
Surface Finish for Flex SMT (1 Message)
surface mounting header using gold plating vs tin plating (1 Message)
Tape bonders (1 Message)
TECHNET Confirmation (5 Messages)
TechNet Digest - 24 Sep 1998 - Special issue (1 Message)
TechNet: confirmation required (79A054) (2 Messages)
test and packaging (2 Messages)
Test Lab for Corrosive Gas Testing (5 Messages)
Test Methods For Conformal Coatings (1 Message)
Thermal Adhesive under SMDs (1 Message)
Thermal profiling units/software (1 Message)
Tin stripper waste treatment (1 Message)
TNMeeting (2 Messages)
Trace to pad spacing design rules (2 Messages)
Trouble with downloading SMT Desk Ref. Manual Samples (1 Message)
Underfill materials (3 Messages)
UNIVERSAL 4785 (SANYO) CHIP-SHOOTER ERROR CODE (2 Messages)
UNSUBSCRIBE (1 Message)
USB Port Specs (2 Messages)
Used PCB cleanimg machine wanted (1 Message)
Vacuum Cabinet (1 Message)
Valor Enterprise 3000 (2 Messages)
via fill (2 Messages)
Vias in chip components pads? (2 Messages)
Wanted: scrap assembled PCB's (1 Message)
Warpage @ Assembly (2 Messages)
Water soluble temporary solder mask (5 Messages)
Wave solder VS Reflow on bottom side (4 Messages)
What should a good C.O.C cover? (2 Messages)
What to compare for HASL v/s OSP (2 Messages)
Why is a respond to sender showing up on the open forum. (2 Messages)
Wire Bonding (1 Message)
Word Game RE Clinton (1 Message)
X-ray for open joints on BGA's ? (13 Messages)
X-ray for open joints on BGA's ? [BGA rel issues?] <IPC T echNet> (1 Message)
X-ray for open joints on BGA's ? [CBGA columns] (1 Message)
[CN] Haloing on PWB (1 Message)
[DC] Pacific Northwest IPC DC Newsletter (1 Message)
[Fab] Fracturing Summary (1 Message)
[TN] Assy.: µBGA Footprints and design guidlines... (1 Message)
[TN] ASSY: BGA FAILURES (1 Message)
[TN] Cleanliness Experiment/Demonstration Ideas? (1 Message)
[TN] ESD labels (3 Messages)
[TN] Fab Solderability Test @ Assembly house (2 Messages)
[TN] g10 (2 Messages)
[TN] Help! Plugging vias (1 Message)
[TN] IC coating (3 Messages)
[TN] Phosphorous In The Nickel Barrier (1 Message)
[TN] Re[2]: [TN] Fab Solderability Test @ Assembly ho (1 Message)
[TN] Seho Wave Soldering Process Procedures (1 Message)