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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 9 Sep 1998 15:44:38 PST |
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All,
Can anyone supply typical values for the following thermal properties
of Biphenol Resins, as used for PED/PEM (particularly surface mount
package) moulding compounds?
I've searched all my usual sources, but only have figures for the
(more common?) Epoxy Cresol Novalac Resins:
Moulding Compound: TCE: Therm.Cond: Tg:
(ppm x 10^6/degC) (W/mdegC) (degC)
----------------------------------------------------------------------
Epoxy Cresol 16 0.67 155
Novalac Resin (some up to 20) (some up to 200)
Biphenol Resin ? ? ?
Thanks for any figures/information,
Regards all,
Clive ffitch
Matra BAe Dynamics (UK)
Stevenage, England
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