Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 10 Sep 1998 07:43:10 -0700 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
hi,
as you are probably aware, the curing agent has a very large effect on
the properties of the cured system. if you haven't had luck with a
manufacturer of molding compounds for these components, you should try
the shell chemical web site at:
http://www.shellchemical.com/
go to their products section and look for epon resins. there are also
email addresses and telephone nos. for you to use. they should be of
help.
phil crepeau
-----Original Message-----
From: Clive Ffitch [mailto:[log in to unmask]]
Sent: Wednesday, September 09, 1998 4:45 PM
To: [log in to unmask]
Subject: [TN] Biphenol Resins
All,
Can anyone supply typical values for the following thermal
properties
of Biphenol Resins, as used for PED/PEM (particularly surface mount
package) moulding compounds?
I've searched all my usual sources, but only have figures for the
(more common?) Epoxy Cresol Novalac Resins:
Moulding Compound: TCE: Therm.Cond: Tg:
(ppm x 10^6/degC) (W/mdegC) (degC)
----------------------------------------------------------------------
Epoxy Cresol 16 0.67 155
Novalac Resin (some up to 20) (some up to
200)
Biphenol Resin ? ? ?
Thanks for any figures/information,
Regards all,
Clive ffitch
Matra BAe Dynamics (UK)
Stevenage, England
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with
following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
################################################################
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
|
|