hi, as you are probably aware, the curing agent has a very large effect on the properties of the cured system. if you haven't had luck with a manufacturer of molding compounds for these components, you should try the shell chemical web site at: http://www.shellchemical.com/ go to their products section and look for epon resins. there are also email addresses and telephone nos. for you to use. they should be of help. phil crepeau -----Original Message----- From: Clive Ffitch [mailto:[log in to unmask]] Sent: Wednesday, September 09, 1998 4:45 PM To: [log in to unmask] Subject: [TN] Biphenol Resins All, Can anyone supply typical values for the following thermal properties of Biphenol Resins, as used for PED/PEM (particularly surface mount package) moulding compounds? I've searched all my usual sources, but only have figures for the (more common?) Epoxy Cresol Novalac Resins: Moulding Compound: TCE: Therm.Cond: Tg: (ppm x 10^6/degC) (W/mdegC) (degC) ---------------------------------------------------------------------- Epoxy Cresol 16 0.67 155 Novalac Resin (some up to 20) (some up to 200) Biphenol Resin ? ? ? Thanks for any figures/information, Regards all, Clive ffitch Matra BAe Dynamics (UK) Stevenage, England ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################