Jim,

You did not read the IPC standard correctly.  In IPC-6012 and in RB-276 it
states that the gold thckness for "areas to be soldered" is 30 microinches,
MAX.  The 30 and 50 micro inches, MIN are for the edge board connectors in
"areas not to be soldered".  Many of us believed that the number in areas to
be soldered for surface mount should be 10 microinches, max. and perhaps 30
microinches,max for through-hole solder joints.

Phil Hinton

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