Fellow professionals:
Yesterday, while doing some research on soldering and a new soldering
method, I discovered that there is a number of U.S. patents for soldering
and soldering techniques. I remember several months ago, there was some
discussion about another company having a general SMT assembly process
patent, but I never found out what the resolution of the issue was. For
example, below is a copy of the abstract of U.S. Patent # 4,605,153 I found
during my research. To me, this sounds like the reflow pads used for MELF
components. I have used this pad numerous times over the years, getting
the idea, and seeing it discussed in SMT magazines, at NEPCON seminars, and
in the IPC design standards. There were numerous other patents listed as
reference with this patent, all pertaining to soldering.
I am not a patent lawyer, and my knowledge of law is limited to one
Business Law class in college and the reading of John Grishm novels. I
consulted our company lawyer, and he has a basic knowlege of patent law,
but was unable to answer the question. He could research it futher. I
thought I would ask my fellow professionals first.
The question: If there is a U.S. Patent for a soldering process, can the
method be used by other companies for assembly? If it is a new process, is
permission needed, etc.? If the process is already in use, learned as
described above, what are the legal ramifications? All of my assembly
knowledge is based on practical experience, reading of journals, training
classes and discussions with you, my fellow professionals. Never has
anyone ever stated that an assembly process is patented, and you must
obtain permission to use this process, or pay royalties, etc. To find that
a SMT pad design is patented really amazed me, if this idea is patented, I
am sure that with futher research that there are numerous other patents for
all aspects of assembly and soldering. At what point, or how is it
determined if the patent is proprietary or is it public domain?
Thanks
Ed Holton
Manufacturing Engineer
Hella Electronics
THE PATENT:
United States Patent
4,605,153
Van Den Brekel, et. al.
Aug. 12, 1986
Shaped solder pad for reflow soldering of surface mounting cylindrical
devices on a circuit board
Abstract
A solder pad is provided at each end of a mounting position for a
cylindrical electronic device on a circuit board. Each solder
pad has two humps of solder spaced apart in a direction normal to the axis
of the device, the humps defining a channel in which
the end of a device can rest prior to being reflow soldered. The humps have
a convex arcuate outer surface in plan view and
when viewed in a direction parallel to the axis of the device has a profile
which is of convex arcuate form. The humps are
formed by depositing a thick patch of solder paste at each hump position
and heating the circuit board and solder paste to melt
the paste. After positioning of devices, the solder is reflowed to attach
the devices.
Inventors:
Van Den Brekel; Jacques (Nepean, CA); Ho; Thomas K. Y. (Ottawa,
CA).
Assignee:
Northern Telecom Limited (Montreal, CA).
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