回覆 : (1 Message)
(Fwd) Cracked Vias (1 Message)
(no subject) (2 Messages)
0402 components skewing, tombstoning, dislodging during SMT reflow (1 Message)
1998 MICROELECTRONICS COURSES (2 Messages)
2-sided fine pitch assembly (4 Messages)
:Electroform Stencil (3 Messages)
<No subject> (8 Messages)
??? (3 Messages)
Acetone of SMT assemblies (5 Messages)
ADMIN: IPC's email forums archives (1 Message)
ADMIN: Re: [TN] ??? (1 Message)
ADMIN: Test - please ignore (1 Message)
ADMIN:Re: [TN] IPCchat session announcement (1 Message)
Advanced Printed Circuit Technology Seminar serving New (1 Message)
Advanced Printed Circuit Technology Seminar serving New England (1 Message)
air voids in multi (8 Messages)
air voids in multi -Reply (1 Message)
Ammonia Etchant - Replenisher (4 Messages)
Any No Clean Flux for Thick PCB's? (4 Messages)
Asf for Information (1 Message)
Assembling backplane PWBs (1 Message)
Assembly (1 Message)
Assembly - Conformal Coating (1 Message)
Assembly Floor Humidity Requirements (7 Messages)
Assembly Floor Humidity Requirements -Reply (1 Message)
ASSY: Conductive epoxies and radiation exposure (3 Messages)
Assy: Forced Air Convection Ovens (4 Messages)
ASSY: Non-wetting QFPs (1 Message)
ASSY: Non-wetting QFPs -Reply (1 Message)
Assy: Reflow Oven Card Carriers (4 Messages)
Assy: Soldering Terminals (6 Messages)
Assy:Min distance between vias in wavesoldering (3 Messages)
Au/Pd/Ni Board finish (2 Messages)
Automated Notification of New Document Releases (1 Message)
Automated wirebond verification machine (3 Messages)
BGA reballing, Reply to. (1 Message)
BGA Reballing. (5 Messages)
BGA Reballing. -Reply (2 Messages)
BGA reflow oven profile? (5 Messages)
BGA reflow time (2 Messages)
BGA Rework Site Dressing (2 Messages)
BGA SPECS (1 Message)
Black Oxide (3 Messages)
Board Specification (2 Messages)
Bob Willis Details (1 Message)
Bob Willis e-mail!! (2 Messages)
Bonded PCB Stiffeners (1 Message)
BT resin etching condition (2 Messages)
BT resin etching condition (II) (1 Message)
BuCu for flex circuits (3 Messages)
BuCu for flex circuits -Reply (1 Message)
BURR (10 Messages)
Burrs on FETs (3 Messages)
Calculation formulae for diff. striplines (1 Message)
Call for papers Joint European Conference VII (2 Messages)
CAM Software info. (2 Messages)
Camelot's Gemini paste dispensing (1 Message)
Camtek AOI -Reply (1 Message)
Carbon ink contacts (1 Message)
Chinese Character Sets (1 Message)
Class 3 & No Clean Flux (2 Messages)
CMP Equipment/Process related forum (2 Messages)
Cold Solder and Solder Shorts (2 Messages)
Colight 1630 (2 Messages)
Conformal coating (5 Messages)
Conformal coating -Reply (1 Message)
CONFORMAL COATINGS ON PCBS (4 Messages)
Convection Oven Selection (1 Message)
Copper Pattern Plating Line Improvements (1 Message)
Copper Pattern Plating Line Improvements -Reply (1 Message)
copper plane clearance (3 Messages)
Crack detection under BGA? (6 Messages)
Cracked Vias (6 Messages)
current density of large pads (1 Message)
CuSn Intermetallic growth (1 Message)
Dead Pad Removal (6 Messages)
Dead Pad Removal -Reply (2 Messages)
Des: Thermal relief on gnd/pwr planes (2 Messages)
Design Complexity (6 Messages)
Design for Manufacturing (2 Messages)
Design for Manufacturing -Reply (1 Message)
Design Requirements (1 Message)
Detached QFP. (2 Messages)
DFX - Design for Excellence (2 Messages)
DIMMS Card Assemblies (1 Message)
Drills (3 Messages)
Dynapert technician (1 Message)
EKRA screen and stencil printing machines (1 Message)
Electroless tin (1 Message)
Employment opps (2 Messages)
Entek boards / In Circuit Testing problems (6 Messages)
F&K & ASM equipment feedback (1 Message)
FAB: BeCu for flex circuits (1 Message)
Fab: Dishdowns? (2 Messages)
Fab: Dishdowns? -Reply (1 Message)
FAB: HASL vs. anything else (3 Messages)
FAB: HASL vs. anything else -Reply (3 Messages)
FAB: HASL vs. anything else -Reply -Reply (4 Messages)
FAB: HASL vs. Flubber (2 Messages)
FAB: HASL vs. Flubber -Reply (1 Message)
FAB: Horizontal electroplating line (1 Message)
FAB: Peroxide Microetch Degreasers (3 Messages)
FAB: Pure Gold Process (2 Messages)
fab:B24 board connector (2 Messages)
File format for Shinkawa wire bonders? (1 Message)
filling the copper (2 Messages)
Finding shorts & opens inside PWB's (6 Messages)
Flip Chip (3 Messages)
Flux Corrosivity (2 Messages)
Flux Evaluation-reply (2 Messages)
FOOTPRINTS (3 Messages)
Forced Air Convection Ovens (12 Messages)
FR4 Laminate (2 Messages)
FR4 Laminate details (5 Messages)
FR4 Laminate details (in India...) (1 Message)
FSL (3 Messages)
GDS2 (1 Message)
GEN: Comparison Study (1 Message)
GEN: Where to get: Conformal coating (1 Message)
Gold Flash benefits over HAL (7 Messages)
Gold Plating and solderability ? (5 Messages)
Gold Plating Question (11 Messages)
Gold Tinning Pot (2 Messages)
Greater Boston IPCDC Chapter Meeting, Jan 7th @ 6pm (1 Message)
Haloing (3 Messages)
Haloing Part 2 (1 Message)
HASL solder specs (1 Message)
help (1 Message)
HELP - Obsolete CEM-1 .063 1/1 (1 Message)
Help! (2 Messages)
Hi Check parts (1 Message)
High voltage circuit trace questions. (2 Messages)
How to contact Walt Brandler (1 Message)
Immersion Gold & Compliant Pin (2 Messages)
Info for the PCMI (1 Message)
Inquiry on persons (2 Messages)
IPC homepage address (3 Messages)
IPC question (3 Messages)
IPC SPECS and PWB COUPONS (1 Message)
IPC Standard (or any other) for building cables (2 Messages)
IPC-MF-150 (2 Messages)
IPC-MF-150 -Reply (1 Message)
IPCchat session announcement (5 Messages)
j-std-001 a and b (1 Message)
j-std-001a/b (2 Messages)
JEDEC website? (3 Messages)
Jumper wire adhesive (8 Messages)
Just a few additions to Ed's thought... (1 Message)
Ken Patel (1 Message)
Ken, (1 Message)
Lamination Hold Times (3 Messages)
Laminators and IPC-4101 (1 Message)
Landpatterns for TQFP devices (8 Messages)
Late Material or Parts (3 Messages)
Late Production Cost Analysis (1 Message)
Lead Soderability - second reflow (3 Messages)
Lead Soderability - second reflow -Reply (1 Message)
Lead Solderability - second reflow (2 Messages)
Lead Solderability - second reflow -Reply (2 Messages)
Little coax connectors (2 Messages)
Looking for: PCB laminate trading company (1 Message)
meba machines (1 Message)
Mentor Users (3 Messages)
Metallurgical Failure Analysis course (1 Message)
MIL Board (1 Message)
MIL SPEC HI REL CLEANLINESS VALUE IN mg/sq in? (2 Messages)
Mil Spec. (6 Messages)
MIL-810E humidity test (1 Message)
Mil-P-55617 (2 Messages)
Minimum dia drilled (2 Messages)
Moisture Sensitive Devices - Absorption Labels (1 Message)
MTBF calculations for a system (4 Messages)
Multi-Layer Boards (1 Message)
Need a test lab for IC failure analysis (3 Messages)
Need an Omegameter (1 Message)
New IPC Designers Council chapters (1 Message)
Not All Solder is Made Alike? (3 Messages)
Olin 7025 (2 Messages)
Op AMp cross reference (3 Messages)
Organic residue in cupric chloride fina (1 Message)
Organic residue in cupric chloride final etch (3 Messages)
OSP (3 Messages)
OSP & Galvanic Etch (4 Messages)
OSP RESIDUE (1 Message)
Overheated solder joints (5 Messages)
Overheated solder joints -Reply (1 Message)
Oxide Lines (1 Message)
passing grade SIR testing (3 Messages)
Paste velocity thru apertures (approximate value) (5 Messages)
Paste velocity thru apertures (approximate value) -Reply (1 Message)
PCB Design Verification Tools (1 Message)
PCB Laminate FAQ (1 Message)
PCB Laminate FAQ - Vetronite ? (1 Message)
PCB Mfg - Cam software survey. (6 Messages)
PCB Solderability Analysis (7 Messages)
Philadelphia Designers Council (1 Message)
Pinless Lamination (1 Message)
Pinless Routing (External Pinning Method) (1 Message)
Plating Adhesions and Poiso (1 Message)
Pluractec (3 Messages)
Pluractec / pinning machines (1 Message)
Poor soldering of 240 pin PQFP (1 Message)
POOR SOLDERING OF 240 PIN PQFP LEADS (1 Message)
Poor Soldering of 240 pin PQFPs (1 Message)
Poor Soldering of 240 pin PQFPs -Reply (1 Message)
Poor Soldering of 240 pin PQFPs more info (4 Messages)
Post Lamination Edge Finishing (2 Messages)
Power Backplane Technology (1 Message)
Pre-Wave Solder Baking (1 Message)
Preflux (1 Message)
Process eval. boards (1 Message)
pull test >>> IPC FELLOW NEEDED PLEASE ! > IPC-SM-785 ! (3 Messages)
pull test std (3 Messages)
Punch needed (2 Messages)
PVC (1 Message)
PWB Coupons (3 Messages)
Re : Design Houses in Australia (2 Messages)
Re. Wave solder machine (2 Messages)
Reduced Black Oxide (4 Messages)
Reduced Black Oxide -Reply (1 Message)
Reflow time for BGA and SMT (4 Messages)
Reflow time for BGA and SMT -Reply (1 Message)
Remove (3 Messages)
Request for Stencil Aperture Shapes (1 Message)
Research money available for the industry (1 Message)
respons on trace impedance over perforated planes (1 Message)
RF Circuitry and Rosin Core Solder (10 Messages)
RF layouts (2 Messages)
routing (3 Messages)
scicards conversion (3 Messages)
Serial # on PCB Washing off in rinse (4 Messages)
Serial # on PCB Washing off in rinse -Reply (3 Messages)
Shrinkage Probelm in CEM-3 Material (1 Message)
sign off assistance for Anthony Peirano (1 Message)
Silver Conductive epoxy (3 Messages)
Silver epoxy (1 Message)
Silver epoxy again (1 Message)
Simon, (1 Message)
SIR Reading (4 Messages)
SM'97 Presentation Material (1 Message)
Small holes, Thick Boards & Hole Reliability (6 Messages)
SMT Connector Testing (1 Message)
Solder Paste on PTH Boards. tickness=125 mils (2 Messages)
Solder Paste Safety (1 Message)
Solder spots on gold fingers (6 Messages)
Solder spots on gold fingers -Reply (1 Message)
Solder Thickness (1 Message)
Solderability During Remelt (2 Messages)
Solderability During Remelt -Reply (1 Message)
Soltec Wave Solder Machine (1 Message)
Soltec WaveSoldering Machines (3 Messages)
SPEC. OF IVH,BVH (3 Messages)
Splice tape... (2 Messages)
Stencil Aperture Shapes (2 Messages)
Stencil Aperture Shapes -Reply (11 Messages)
Stencil Aperture Shapes -Reply -Reply (1 Message)
Stencil Aperture Shapes -Reply -Reply -Reply -Reply (1 Message)
Stencil Format (1 Message)
Stencil Format- correction (1 Message)
Stencil Print Glue (2 Messages)
Steve McBride [TN] Design for Manufacturing (1 Message)
subscribe (2 Messages)
Summary (and Closure?) RE: Area of Cylinder (1 Message)
Surface Mount Council Annouces Vision 2010 Workshop. (1 Message)
Surface Tension Constant (1 Message)
Tech Net Listing (1 Message)
TechNet Digest - 13 Jan 1998 (2 Messages)
Technical handbook credits (1 Message)
Techniques to locate power and ground short on PWB bare board (1 Message)
test,please ignore (2 Messages)
Thank you all (7 Messages)
Thank you all! (1 Message)
Thermal Conditions to Cause Damage to MSDs (1 Message)
Thermal cycling (4 Messages)
Thermal Relief at Ground/Power Plane Connections (6 Messages)
Thermal relief/ Forced Convection (1 Message)
Thermal relief/Sub-contract (1 Message)
Thermount properties (2 Messages)
Thermount properties -Reply (1 Message)
Thickfilm process / hybrids (3 Messages)
Tin/Lead Reflow vs. SMOBC (1 Message)
Tin/Lead Reflow vs. SMOBC -Reply (1 Message)
To Dimitry Skylar (1 Message)
Tombstoning of 1210 Caps (6 Messages)
Tombstoning of 1210 Caps -Reply (1 Message)
Trace Impedance over a gridded ground plane ... (3 Messages)
Track spacing for FCC requirements (3 Messages)
UL 94V-0 Question (7 Messages)
unsubscibe (1 Message)
UNSUBSCRIBE (4 Messages)
UNSUBSCRIBE!!!!!!! (1 Message)
Use of Solder Mask Defined pads for BGA ? (7 Messages)
Used Amistar and Herotech for sale (1 Message)
VENTURE CAPITALISTS TELL ALL ON CD- (2 Messages)
Wafer Backgrind tape (1 Message)
Wave Solder requirements (1 Message)
What is gerber & what format is good.... (5 Messages)
white tin (2 Messages)
Wire Bonding (3 Messages)
You might all be interested in the definitive manual on "today's (1 Message)
You might all be interested in the definitive manual on"today's (1 Message)
[2] Design Complexity (1 Message)
[ASSY] Request for Info. (2 Messages)
[DC] Question on Plated holes (2 Messages)
[Fwd: BGA VOIDS] (1 Message)
[TECHNET] ADMIN: ChipNet Moved to the new mailsystem. (1 Message)
[TECHNET] ADMIN: ComplianceNet Moved to the new mail system. (1 Message)
[TECHNET] ADMIN: IPCsm840 Moved to the new mailsystem. (1 Message)
[TECHNET] ADMIN: Roadmap Moved to the new mailsystem. (1 Message)
[TECHNET] ADMIN: TechNet Moved to the new mailsystem. (1 Message)
[TN] Acetone of SMT assemblies (1 Message)
[TN] Ammonia Etchant - Replenisher (4 Messages)
[TN] BGA Coplanarity (2 Messages)
[TN] BURR (2 Messages)
[TN] Flux Evaluation (1 Message)
[TN] Forced Air Convection Ovens (1 Message)
[TN] Need a test lab for IC failure analysis (1 Message)
[TN] PCB Mfg - Cam software survey. (1 Message)
[TN] RF Circuitry and Rosin Core Solder (1 Message)
[TN] SIR Reading (3 Messages)
[TN] Steve McBride [TN] Design for Manufacturing (2 Messages)
[TN] What is gerber & what format is good.... (1 Message)
[TN] Wire Bonding (1 Message)