Robert,
Sure. We have our tooling shop fab the press-fit pins for us, based on the
PWB tooling hole size and PWB board thickness. I write a quick program and
use our board router to fab the pallets (a.k.a. card carriers).
We design the PWB panel to have both a primary and secondary set of
tooling holes and slots. We fabricate the pallet so that low profile tooling
pins (No dings allowed in my stencils, please) are press-fit into the
pallet, and are aligned to the secondary tooling holes of the PWB, which
will locate the PCB to the pallet. In the pallet itself, we "open-up" holes
thru the pallet underneath the primary tooling hole loctions, so when the
pallet\board is coming down the line, the SMD equipment locator pins come
thru the pallet and locate on the PWB master tooling holes, just like they
normally would, for PWB-to-SMD program alignment. This has been very
successful for us, especially for thin PCMCIA's, etc, which the designers
seem to enjoy throwing at me lately!
Hope that was comprehensible, if not feel free to contact me directly,
phone # listed below. Good Luck!
At 08:25 AM 1/30/98 -0500, you wrote:
>Could you provide me with a source for the press fit pins and a brief
>description of how you set them into the tool?
>
>RAV
> ----------
>From: Jeffery L. Hempton
>To: [log in to unmask]
>Subject: Re: [TN] Assy: Reflow Oven Card Carriers
>Date: Monday, January 26, 1998 6:31AM
>
>
>Andrea,
> We have had great success using stock .062" thick PWB material as card
>carriers. We also have more of a high-temp material that has proven to
>withstand many reflow cycles. I even use our board router to fabricate
>the
>carriers, which is a plus since I can fab everything in our department
>cheaply. Then we put press-fit pins in to locate the boards. We normally
>use
>this method to add extra support for board assemblies that are
>.020"-.035"
>thick, but it could be utilized for your function. The obvious concern I
>would have with 1\4" thick stock is all that mass effecting your reflow
>profile...if you are running forced air convection, it is a little less
>of
>a
>concern, but still going to effect your profile/reflow greatly. Feel
>free
>to
>call me directly if I can answer specifics for you.
>
>At 04:37 PM 1/23/98 -0500, you wrote:
>>I would like some help on finding a good material for making card carriers
>>to go through the reflow oven. We will be assembling a card with PTH
>>connectors on both sides and will use the paste in hole process. The
>>carrier would hold the bottomside connectors and support the board but
>>cannot absorb too much heat to affect reflow. I have heard of ECP Plus
>>from EMC and Delmat for making wave solder card carriers. Are those
>>materials good for reflow as well? Is there anything better, less
>>expensive, easier to machine, etc. out there? I would like to get the
>>material in approximately 1/4" thick sheets and then have them milled out
>>in our machine shop. You can e-mail me directly at [log in to unmask]
>>
>>Thanks for your input,
>>Andrea Shurtz
>>Lexmark Electronics
>>
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>>
>>
> ----------------------------------
>Jeff L. Hempton phone: (219) 429-7335 Fax: (219) 429-4688
>Boardshop Manufacturing Engineer Mail Stop: 25-31
>Raytheon Systems Company
>1010 Production Road, Fort Wayne, IN 46808-4106
>Email: [log in to unmask]
>
>"The man who rolls up his sleeves seldom loses his shirt."--Thomas Cowan
>
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>################################################################
>Please visit IPC web site (http://jefry.ipc.org/forum.htm) for
>additional
>information.
>For the technical support contact Dmitriy Sklyar at [log in to unmask] or
>847-509-9700 ext.311
>################################################################
>
>
>
----------------------------------
Jeff L. Hempton phone: (219) 429-7335 Fax: (219) 429-4688
Boardshop Manufacturing Engineer Mail Stop: 25-31
Raytheon Systems Company
1010 Production Road, Fort Wayne, IN 46808-4106
Email: [log in to unmask]
"The man who rolls up his sleeves seldom loses his shirt."--Thomas Cowan
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################
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