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January 1998

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Subject:
From:
Krishna Kalyan <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 6 Jan 1998 13:59:13 PST
Content-Type:
text/plain
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text/plain (26 lines)
Tech Netters :
  Hello all. Thanks for all your suggestions. My problem is not as
simple as it sounds because I have a (BIG) through hole component that
is inserted on the top side which needs to be soldered along with other
SMCs. So I need to have high enough a temperature on the bottom side to
solder this BIG component while keeping my other problem-prone SMC on
the bottom side intact !

Regards
Krishna Kalyan

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