European Joint Conference VII Paris, June 2-3, 1998
The New Role of PWB's in the Electronics Supply Chain
CALL FOR PAPERS
The EIPC, PCIF and IPC are pleased to host the seventh joint European Conference at
the Hotel Sofitel in Paris. The theme of this year's event is the changing role that
the PWB is having in today's electronics manufacturing environment. Density pressures
from the hand-held market have pushed a number of companies to explore new
manufacturing technologies. Now companies designing high performance workstations
are looking to take advantage of increased routing capabilities as well. EJC VII
will be your opportunity to participate in the latest developments.
Design
· Bringing process innovation into advanced PCB designs
· Transmitting information across the electronics supply
chain
· Advanced data transfer methodology
· Design for manufacturing/Testability
Future manufacturing technologies
· Revolutionary PCB manufacturing methods
· Semiconductors-influenced manufacturing technology
· Direct writing, laser technology, Optoelectronics
circuits, etc.
· Integration of PCB/ packaging, 3D organic packages,
etc.
· Developments in MCM-L, BGA, micro-BGA and other Chip
Scale Packages, Direct Chip Attachment, Chip on Board, etc.
Microvia Technology
· User experience and new developments in laser via
technology
· User experience and new developments in photo via
technology
· Marketing aspects in the development of microvias
· New materials for advanced build-up techniques
· Process improvement in microvia-related processes
(metallization, test, etc.)
Multi Layer Technology
· Materials and Process improvement in MLB production
process
· Fine-Line and High Density standard multilayers
Double-Sided and Single-Sided technology
· Materials and Process improvement in SS/DS production
processes
· Alternative PCB fabrication process for SS and DS
Flexible/special PCB¹s
· New materials, processes and applications for flexible
interconnects
· Innovation in Flex-Rigid, Multiwire technology
Marketing and Management
· Mergers and Acquisitions, industry restructuring
· One-stop shopping concept
· How to finance investments for future technology
· Increasing profitability in the I&P industry
· Innovative ideas in personnel management
· TQM and IQA
· European and World markets
· Technology/market roadmaps
· Process/financial benchmarks
End User and CEM issues
· Contract Assembly or Electronics Manufacturing Services
(EMS) and their impact on the PCB supply chain
· Evolution of the various OEM end-markets: Telecom,
computer, automotive, industrial, consumer electronics, military.
Environmental protection
· Lead less electronics: alternative finishing,
soldering, etc.
· Recycling of liquid effluents/solid waste
· Innovation in regenerating solutions, water treatment
plants, etc.
· Efficient metal recovery in the PCB industry
· European legislation and its impact on the I&P industry
OR ANY INNOVATIVE PRESENTATION ON TECHNICAL & MARKETING ISSUES IN THE INTERCONNECTION
& PACKAGING INDUSTRY
The Place
The conference is scheduled in the Hotel Sofitel in Paris.
Speakers to EJC VII are, as usual, offered free access to the conference, Gala
dinner, proceedings and one hotel night.
How to submit a paper.
Please submit your title and abstract (max: 500 words) to:
EIPC
Att: Eric Toumieux
Hegenheimermattweg 65, 4123 Allschwil Switzerland
Tel: ++41 61 482 39 00
Fax:++41 61 482 39 10
E-mail: [log in to unmask]
Deadline
Deadline for abstracts is February 15, 1998
Deadline for submission of final Camera Ready paper to the EIPC office is May 1,
1998.
ABSTRACT FOR EUOPEAN JOINT CONFERENCE VII
"The New Role of PWB's in the Electronics Supply Chain"
Company:
Address/Tel/Fax:
Name of Speaker:
Title of Paper:
Abstract: (you may use additional space if necessary)
Please return to EIPC by February 15, 1998
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