Good Day,

   We are interested lengthening the hold time or  'time on copper'
of our laminated photo resist. Currently our pre-lam prep consists
of a 5% sulfuric dip, water rinse, turbine dry following the direct
metalization
process.

       Will the use of acetic acid decrease the potential for resist lock in?

       Will warm air, IR drying or an oven pre-bake also extend the hold time?

and  What kind of hold times, optimally, can I expect?

Thanks in advance

Brett Austin
Nationwide Circuits

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