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January 1998

TechNet@IPC.ORG

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Subject:
From:
DAVID C WEBER <[log in to unmask]>
Reply To:
Date:
Thu, 8 Jan 1998 19:59:29 -0500
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For high temperature (>100 deg C) use gold over nickel. The nickel stops
copper migration. For low currents use gold, there's nothing better. It's
needed on both the terminals and the board. Tin on either makes gold
useless.  For high voltage, use nickel - it's cheaper. If you have deep
pockets (military), contact Ney Company about precious metal terminals
----------
> From: SIRGuru <[log in to unmask]>
> To: [log in to unmask]
> Subject: Re: [TN] Gold Plating Question
> Date: Thursday, January 08, 1998 9:43 AM
>
> In a message dated 98-01-07 08:47:45 EST, you write:
>
> >
> >  I am looking for guidance on choosing gold plating thicknesses and
> >  plating processes for circuit board edge fingers.  For example: What
are
> >  the recommendations for circuit board edge fingers that will be
inserted
> >  into a connector and removed 10 times verses a installation/removal
> >  cycle of 50 times?
>
> Along the same lines, I have an application where I mate / de-mate a
connector
> hundreds of times.  I would ask the TechNet crowd which would be better,
gold
> or a hard nickel?
>
> Doug Pauls
>
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