TECHNET Archives

January 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Electroless tin
From:
Bogdan Gaby <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Mon, 12 Jan 1998 17:22:56 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines) 
Hello,TechNetters,
Could someone who already uses electroless tin plated boards share
his-her experience with me?
I am interested in shelf life,fluxes,solder pastes and profiles.
Is there a difference in solder paste height requirements?
What about BGA's?
Thank you,
Gaby

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################

ATOM RSS1 RSS2